2017年1月18日 星期三

Samsung, LG adopt thermal pipes for smartphones to be launched in 2017

Samsung Electronics has adopted thermal-pipe heat dissipation solutions for its Galaxy S8 which will launch in March 2017, with thermal pipes to be produced by Taiwan-based Auras Technology and Chaun Choung Technology (CCI). Meanwhile, LG Electronics will use heat-pipes supplied by Japan-based Furukawa Electric and Taiwan-based Delta Electronics in its upcoming G6, according to Taiwan-based supply chain makers.

from DIGITIMES: IT news from Asia http://ift.tt/2jYjfIS
via Yuichun

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