The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of approximately US$4.91 billion to expand capacity for advanced-node manufacturing, as well as upgrading advanced packaging capacity to next-generation technology, R&D capital investments and sustaining capital expenditure for first-quarter 2017.
from DIGITIMES: IT news from Asia http://www.digitimes.com/news/a20161108PM203.html
via Yuichun
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