Intel reportedly is planning to add USB 3.1 and Wi-Fi functions into its motherboard chipsets and the new design may be implemented in its upcoming 300-series scheduled to be released at the end of 2017, according to sources from motherboard makers. Intel declined to comment on market speculation.
from DIGITIMES: IT news from Asia http://www.digitimes.com/news/a20161110PD210.html
via Yuichun
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