2016年11月8日 星期二

Electronica: Toshiba to build new 3D flash memory fab

Toshiba is to expand production of its proprietary 3D flash non-volatile memory and has announced plans to build a wafer fabrication facility at Yokkaichi, Japan for expanded production of BiCS Flash. The production line will use artificial intelligence (AI) for the first time. The plan to build a new 3D flash facility was announced in March, and construction will now start ...

Read full article: Electronica: Toshiba to build new 3D flash memory fab



from News – Electronics Weekly http://ift.tt/2eJk9sV
via Yuichun

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