Taiwan-based DRAM chipmaker Winbond Electronics will begin volume production of memory chips on a 3x nm process in the fourth quarter of 2016, according to a Chinese-language Commercial Times report, citing company president Tung-yi Chan.
from DIGITIMES: IT news from Asia http://ift.tt/2e1DpBM
via Yuichun
沒有留言:
張貼留言