ASE ready to enter volume production of fan-out wafer-level packaging

Advanced Semiconductor Engineering (ASE) has reportedly obtained orders for fan-out wafer-level packaging (FOWLP) from Qualcomm, MediaTek and HiSilicon with volume production set to kick off by the end of 2016, according to industry sources.

from DIGITIMES: IT news from Asia http://ift.tt/2dHKHH0
via Yuichun