2016年9月20日 星期二

Chipbond 3Q16 gross margin to reach 26%, says report

Chipbond Technology is expected to see its third-quarter gross margin reach the highest quarterly level since 2015, buoyed by strong shipments for high-margin power amplifiers, according to a report by Taiwan's Central News Agency (CNA).

from DIGITIMES: IT news from Asia http://ift.tt/2cnT1Qx
via Yuichun

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