Toshiba Samples 64-Layer 3D Flash at 256 Gbit Density

Toshiba Corporation has disclosed the latest generation of its BiCS FLASH three-dimensional (3D) flash memory with a stacked cell structure, a 64-layer device that it claims as the first to start sample shipments.

from EETimes: http://ift.tt/2auK6XB
via Yuichun