Next-Gen IoT Consortium Launches

Singapore's Institute of Microelectronics (IME) to form a consortium for microelectromechanical system (MEMS, including Delta Electronics, Inc., InvenSense Inc., Standing Egg Inc., STATS ChipPAC Limited, ULVAC, Inc.) and silicon photonics packaging breakthroughs (including Accelink Technologies Co., Ltd., Corning Incorporated, Fujikura Ltd., Fraunhofer Heinrich Hertz Institute and NTT).

from EETimes: http://ift.tt/2arp3pn
via Yuichun