Solar-grade polycrystalline silicon wafer maker Green Energy Technology (GET) on July 19 announced that it has obtained a patent for an in-house-developed etching solution and method of surface roughening of silicon substrates, and an etching technology for processing surface of silicon wafers, from the Intellectual Property Office under Taiwan's Ministry of Economic Affairs.
from DIGITIMES: IT news from Asia http://ift.tt/29MoEhM
via Yuichun
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