2016年5月17日 星期二

Smarter Signoff with Hierarchical STA

With design sizes expected to increase by 5X through 2020, flat chip-level STA becomes more challenging due to runtimes & memory requirements. This video provides an overview of the next gen of hierarchical STA, delivering a long term solution to this challenge.

from EETimes: http://ift.tt/1Xkgsci
via Yuichun

沒有留言:

張貼留言