Digitimes Research: IC manufacturers to cross into packaging industry

With IT products such as smartphone and Internet of Things (IoT) devices being designed with considerations of high performance, low cost, low power consumption and small form factor, IC makers have been pushing 16/14nm processes and developing 10nm processes to satisfy demand. However, as Moore's Law starts slowing the pace of advancement, many IC makers have crossed into the packaging industry to continue to meet demand.

from DIGITIMES: IT news from Asia http://ift.tt/1XBjZl3
via Yuichun