Fully-Depleted Silicon on Insulator May Be Fully Accepted in 2016

FD-SOI is out of the woods and will begin exponential growth in 2016. What started with a 3-D fix for Intel hitting the leakage wall with bulk silicon, followed by claims of an easier way from companies, have finally morphed full circle. Now the SOI Consortium members Freescale, IBM, Imec and Soitec itself are prototyping 3-D fins atop a Soitec wafers to super-fully-deplete the channel.

from EETimes: http://ift.tt/1ThXSgE
via Yuichun