2015年7月31日 星期五
Silicon Valley's Longest-Serving CEO Beginning New Chapter
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Assembling Next-Gen Light Fixtures
LED fixtures and luminaires are challenging to mass-produce.
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Ensuring Traceability in Electronics Assembly
Data from a traceability system can be used for process improvement, defect resolution and regulatory compliance.
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Jet Dispenser Applies Epoxy Underfill Material for Hearing Aid Assembly
Protecting one's hearing is always a smart thing to do. Hearing-aid manufacturer GN ReSound (GNR) believes that improving one's hearing is just as smart.
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Robot-Mounted Vision System Simplifies Large-Part Inspection
Designing an automated, inline system to perform final quality inspection of a large or complicated assembly can be tricky.
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EEVblog #774 – Low Battery Discharge Testing Part 1
Dave shows how to do discharge testing on AAA and AA alkaline batteries, for the specific purpose of investigating how much energy is left under the industry standard 0.8V cutout voltage.
This is an explanation of the test setup, verification, and a sample plot of some data before the long term testing.
The setup consists of the BK Precision 8500 electronic load, the Keysight 34470A 7.5 digit meter, and the Rigol DP832 for testing.
Negative feedback T-Shirt
Energizer AAA battery datasheet
Duracell AAA battery datasheet
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Perambulating & Texting -- Dazed & Confused
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IBM Takes A Second Turn at PCM Drift
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The Next Big Thing Is The Continuum
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Making EDA Exciting Again
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Turing Test -- Are You Talking to a Human or a Machine?
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MediaTek Cautions 'Weak Demand' for Handsets
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Patent Search Supports View 3D XPoint Based on Phase-Change
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Processor brings 1080p video to car rear-view mirrors
ON Semiconductor has developed a range of image co-processors to work with 1.2 and 2 megapixel image sensors specifically in automotive rear view and surround view cameras.
According to Sandor Barna, vice president at ON Semiconductor, the processor will support both 1080p and 720p video in automotive applications.
“We have added higher resolution, multiple interfaces and new automotive-targeted features such as ASIL support,” said Barna.
The AP0200, AP0201 and AP0202 support up to 2 MP 1080p image sensors, and the AP0102AT supports up to 1.2 MP 720p image sensors.
The chips will be used for functional safety features Automotive Safety Integrity Level (ASIL) levels A and B. They support 30 frames/second (fps) operation at 1080p, 45 fps at 960p and 60 fps at 720p.
They also support Ethernet or parallel output interfaces, and incorporate I2C, SPI (Serial Peripheral Interface) and general purpose input/outputs (GPIOs).
Each has an operating temperature range of -40 °C to +105 °C (ambient) and is fully AEC-Q100 qualified.
The co-processors are designed to be used in combination with the firm’s image sensors such as the 1 MP AR0140AT, AR0132AT and AR0136AT, as well as the new AR0230AT 2 MP 1080p sensor.
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Industrial Automation Companies Combine
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Hybrid Solar Cells Capture More
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Google Street View Cars Test The Air
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Imec, Panasonic Push Progress on ReRAM
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USB will carry 4K video with new connector design
Could a USB connector support 4K high definition video? This is what the industry intends and a new look USB connector is likely to start appearing in PCs, TVs and mobiles over the next year.
The Type-C connector, as it is called, is expected to take over from the micro USB as the standard connector for multi-gigabit USB 3.0 interfaces.
What do USB Type-C connectors offer over the Type-A and Type-B USB connectors we are all so familiar with?
It will support the 10Gbit/s data rates which will make it a practical alternative to today’s HDMI connectors on your television.
The connector’s 32-pins can be configured to support higher speed video data standards such DisplayPort, MHL, and Thunderbolt. This is referred to as “alternate mode” Type-C.
Significantly, the Type-C connector in alt mode will support 4K video as defined in the USB 3.1 standard.
USB has made its name by being a power connector as well as a data interface. The new connector extends the power capabilities. The maximum power rating is 100W.
But it also supports bi-directional power flow to allow a device to either source or sink power.
It also supports simultaneous power and data transfer.
Type-C connectors also offer scalable power ranging from 5.0V at 0.5A for handheld devices up to 20V at 5.0A for fast charge.
The big change to the mechanical design of the Type-C connector is its reversible plug orientation and cable direction.
Type-C needs new USB transceivers, filters and interface devices and the first ICs are appearing on the market.
One of the first Type-C controller/driver packages comes from NXP Semiconductors, and others are likely to follow very soon.
The important Type-C devices are: the USB3 re-drivers, ESD protection and filtering devices, USB PD PHY, authentication, load switches and high speed switches.
The PC and mobile industry, including Apple, seems to think the redesign of the USB connector interface is necessary and worthwhile to support the growing hunger for high speed data transfers to mobile devices.
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Water repellent coating improves capacitor reliability
Murata has developed a water-repellent coating that it claims will increase the reliability of multi-layer ceramic capacitors.
At issue is condensation – not just between the PCB and he capacitor, but on any capacitor surface that can gather condensation.
When water wets the surface of the caoacitor – top diagram – electromigration of electrode metals can occur which can eventually grow into a short circuit between the capacitor electrodes.
With the anti-wetting coating, which is permamantly applied, water droplets can not bridge from electrode to electrode and the scope for electromigration is significantly reduced – middle diagram.
“This capacitor has applications particularly in navigation systems, body control electronic control units [ECUs], air conditioner ECUs, meter ECUs and engine ECUs,” said Murata.
Sample shipments have begun and mass production is scheduled within a year.
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Will car makers become internet companies?
Connected vehicles will create a new business opportunity proving the internet-based mobile services to the driver.
Car manufacturers will soon be competing against technology companies to provide the online services to connected cars.
Autonomous connected vehicles are seen as the first major market for so-called internet of things (IoT).
This will be an important market for IC and hardware system suppliers. But arguably the biggest market opportunity will be in the provision v of online services that support the IoT devices in the car.
Car manufacturers see this as their domain and they want a major slice of the business. But to do this they will have to compete with IT firms and partner with software suppliers.
According to chip supplier NXP:
“The race to win the future mobility services business has begun. It is wide open on how automakers will fare versus the technology companies.”
Existing automotive technologies and business models that have worked for the car industry for a century are not so well suited to a changing car market with autonomous vehicles and IoT-connected cars.
“So will technology companies like Uber win this race by adopting new and successful business models?” asks NXP.
In order to address the connected vehicle opportunity it will be necessary to form cross-industry groups. This will combine car makers with electronics firms and software services suppliers.
No single sector will be able to capitalise on this market, due to its diversity and the range of technologies required.
Putting electronics management systems in cars was only the beginning. Connecting vehicles to the internet will add a far greater level of complexity to the automotive business model.
According to NXP, the convergence of personal and public transportation markets, will force car manufacturers to make “a leap of faith and fundamentally transform their value chain”.
NXP believes car makers will find themselves fighting on two major battlefronts.
Their core activity will be designing new forms of autonomous connected vehicles, but to be successful in the connected vehicles market they will need to develop and sell internet based services.
Whether they are successful in doing this will determine they business growth in the years ahead.
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Chips at risk from bad voltages, says Mentor
Electrical reliability and protection from electrostatic discharge (ESD) has become more important to IC designers as on-chip geometries shrink and device complex increases.
ESD is not a new phenomenon in chip design but its importance to IC designers has increased in recent years.
The main factors for this are:
· Smaller on chip geometries for wiring as well as feature size.
· Multiple power islands on the one chip
· Designing in third-party silicon IP
“The big risk designers have is from allowing inappropriate voltages being applied to different parts of the circuit on the same die,” says Carey Robertson, product marketing director at Mentor Graphics.
Chip reliability is also enforced by industry standards such as the ISO26262 automotive device certification.
This puts greater pressure on the chip designer to check for issue such as electrical overstress, over-heating and latch-up at all stages of the design.
“This means designers must ensure the longevity of devices especially if they are being designed into applications such as automotive or medical,” says Robertson.
So what does the designer need to think about?
· Current density limits for specific areas of the die
· Identifying power islands within the design
· Pad spacing
· Bond wire widths
· Resistance matching
Foundries have their own reliability check. For example TSMC will give designers an ESD/latch-up design kit with as many as 60 design rule checks for 28nm devices and below.
For many designers this could be a new task for them, and the EDA firms have now introduced tools which can automate the process to a great extent.
Mentor’s tool for performing ESD and multiple power domain checks is called Calibre PERC.
According to Robertson, geometrical and electrical verification requirements must be described by a topological view rather than single device/pin to net relation.
“The tool can give a topological view incorporating many layout-related parameters as well as circuitry-dependent checks,” says Robertson.
According to Robertson, there will be an inevitable increase in the design cycle runtime, but he says this can be typically “a matter of hours”.
Designers will have to budget for this, because this is a world where customers are increasingly looking for device longevity as well as performance and low cost.
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Electronic dictionary vendor Global View sets up business incubator in Beijing
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Silicon Motion to offer solutions for 3D XPoint devices
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Taiwan promoting recycling of household wastewater for industrial use
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FET arranges stake investment in CNS via buying corporate bonds
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Innolux to merge with CMEL
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Taiwan IC design houses expect orders for handsets to pick up in August
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LG top TV panel supplier to China in 1H15, says firm
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Acer pushing investments in startups
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MediaTek posts lower revenues and profits for 2Q15
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Sharp plans to stop in-house production of a-Si thin-film PV modules, says Nikkei News
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Digitimes Research: China smartphone AP shipments to grow 23.5% in 2H15
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Global smartphone shipments growth slows to 15% in 2Q15, says Strategy Analytics
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Mouser ships Intel Compute Stick
Mouser is shipping the Intel Compute Stick with Ubuntu Linux which enables any screen with an HDMI interface to become a fully functional personal computer.
The stick has pre-installed Ubuntu 14.04 LTS OS.
It has a 64-bit 1.33GHz Intel Atom Z3735F Quad-Core processor with 2Mbytes cache, integrated Intel HD graphics, and multi-channel digital audio.
It plugs into any display that has an HDMI 1.4a interface. Networking is achieved with onboard IEEE 802.11 b/g/n WiFi, and peripheral connectivity is available through the Bluetooth 4.0 and USB 2.0 interfaces.
Once plugged into a display’s HDMI port, the user powers the Compute Stick with a wall adapter. A status LED indicates the device is powered while both graphics and audio is provided through the HDMI port. The device can be controlled through a wireless keyboard and mouse.
The stick has 8GBytes of eMMC Flash for user file storage and 1GByte of RAM. An Intel Compute Stick running Microsoft Windows 8.1 is also available from Mouser Electronics. Flash user storage is expandable for both versions through a microSDXC slot on the side of the device.
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Antenova adds Sinica for 1559-1609 satellite bands
Antenova, the Hatfield antenna specialist, has launched an embedded GNSS antenna, named ‘Sinica’, which operates on the 1559 – 1609 MHz satellite bands.
Sinica is suitable for all positioning applications on the 1559-1609 MHz bands. It operates with all of the public satellite constellations – GPS, GLONASS, Baidou and Gallileo, which means it can provide accurate positioning combined with global coverage.
The Sinica antenna is created from FR4 materials and new dielectric constant laminate substrates. It uses a new approach to antenna design, which has enabled the company to create an antenna with the high performance of a ceramic patch antenna, in a low profile part that can be placed neatly within a small printed circuit board.
Sinica is designed for devices that need accurate positioning or tracking globally, which means it is suitable to use in drones, network devices and wearable electronics, or any other portable device or tracking application.
Antenova’s product designers recently introduced the concept of “Design For Integration” (DFI), which considers how the antenna will operate when it is embedded with a manufacturer’s product. Antenova’s antennas are always used within a customer’s design, so they are designed to provide superior RF performance from within the device, and to make the integration of the RF elements easier for the designer. In addition to this, Antenova provides its customers with technical support during the design, integration and testing phases.
The antennas are supplied on Tape and Reel.
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K computer claims super computer crown
Having fallen from the peak of the Top 500 list of super computers a few years ago, Japan’s K compute is back up there again, this time on the Graph 500 supercomputer ranking.
Graph 500 is a relatively new benchmark, from 2010, which seeks to measure supercomputers on data-intensive loads rather than simple speed, “with the goal of improving computing involving complex data problems in areas such as cybersecurity, medical informatics, data enrichment, social networks, symbolic networks, and modeling neuronal circuits in the brain”, said Fujitsi, builder of K computer.
A collaboration between RIKEN, the Tokyo Institute of Technology, University College Dublin, Kyushu University, and Fujitsu got the computer its top place – announced this month at the international conference on high-performance computing (ISC2015) in Frankfurt.
The Tokyo Institute of Technology and RIKEN used 82,944 of K computer’s 88,128 compute nodes to solve a breadth-first search of a graph of 1 trillion nodes and 16 trillion edges in 0.45s, scoring 38,621 gigaTEPS
Sequoia at the Lawrence Livermore Laboratory scored of 23,751 gigaTEPS, and Mira at the Argonne National Laboratoryscored 14,982.
“In June last year we took the top spot with K computer, but we dropped to second place in the rankings of November that year,” said K computer scientist Koji Ueno. “In response, we identified problems in the performance of our previous implementation and developed a new algorithm that allowed us to make some important improvements.”
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ARM buys hardware-based security technology.
ARM has bought the five year-old Israeli security firm Sansa which has a hardware solution for mobile connectivity.
The price is thought to be somewhere around $90 million.
Sansa, which was called Discretix until last October, has had $37 million of VC money and is backed by both Sequoia and Accel among others.
Car-hacking demonstrations have recently shown the vulnerability of mobile connections to hackers. Software solutions are widely seen as only temporary because hackers find their way round them. Sansa’s approach is via hardware which physically isolates sensitive operations from the apps processor.
“Any connected device could be a target for a malicious attack so we must embed security at every potential attack point,” says ARM’s CTO Mike Muller, “protection against hackers works best when it is multi-layered, so we are extending our security technology capability into hardware subsystems and trusted software. This means our partners will be able to license a comprehensive security suite from a single source.”
‘Sansa has a hardware subsystem that adds additional isolation of security operations from the main application processor,’ says ARM, ‘this is complemented by software components operating on top of trusted execution environments to perform security-sensitive operations.’
Sansa says its technology is in devices sold in quantities on 150 million units a year.
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2015年7月30日 星期四
Virtual reality device shipments to reach 43 million by 2020, with mobile-reliant head mounted displays foremost, says firm
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Acer passes down Stationary Computer and Display BU management to younger executives
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Taiwan market: Samsung launches new Galaxy Tab 4 7.0, Galaxy Grand Prime
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Adlink posts 1H15 net EPS of NT$1.77
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Notebook component makers shift to server applications along with ODMs
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Touch panel suppliers step up shipments for new iPhone
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TPK revenues slip due to decline in handset touch panel shipments
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LED to account for 19% of transportation lamp revenues in 2015, says IHS
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ASE expects to post revenue growth through 4Q15
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Coretronic reports 2Q15 performance
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Taiwan market: Chunghwa Telecom sees 4G user base increase to 2.9 million
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Energy management revenues for healthcare markets expected to reach US$2.2 billion by 2024, says report
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Hua Hong Semiconductor, QST announce 3-axis gyroscope SoC
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UMC slows 28nm ramp
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Friday Quiz: Oscilloscopes
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Inventables X-Carve LIVE Build Part 3 + Batteriser Rant
Part 3 of Dave & David2 assembling the Inventables X-Carve milling machine.
Bonus impromptu rant on the Batteriser for the first 30 minutes!
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Inventables X-Carve Time Lapse Build
Time lapse footage of Dave & David 2 assembled the Inventables X-Carve cutting/milling machine.
6.5 hours of build footage in 2 1/2 minutes
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Samsung's Slippage Stirs Smartphone Angst
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Patents: Exercises in Futility and Incomprehensibility?
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The Best Way to Store Morse Code in C
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NXP Touts Mixed Signal, Auto Gains
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Test is not someone else's problem
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Graphene Lights Up Chips
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M2M connections increasing, but don’t call it IoT
The market for M2M cellular modules and wireless terminals is predicted to grow dramatically over the next three years.
By the end of 2019 the market for cellular M2M modules is expected to reach $2.2bn, according to a new report by Beecham Research.
The numbers of modules and wireless terminal is predicted to more than double in the same period.
Despite the move to 3G and 4G and talk of 5G, Beecham Research says that 2G modules will continue to provide for the majority of new M2M connected devices for the next few years.
“This is particularly the case in Europe where there are no plans to end 2G services. But while 2G module shipments will continue to increase in volume over the period, as a percentage of total shipments they will decline from almost 80% in 2014 to just 50% by 2019,” said the Beecham Research report.
The most common applications for cellular M2M connections are likely to be in smart meters, security alarms, medical devices, parking meters and connected cars systems.
“The increasing sophistication of M2M applications is driving the need for higher speeds, including real time video in security and connected car markets and the addition of service layers on telematics applications such as job scheduling and mobile payment systems,” says David Parker, senior analyst at Beecham Research and author of the report.
“There are a number of potentially disruptive factors in the market including the timing, pricing and acceptance of new technologies like LTE-M and the rise of alternative methods of connecting objects such as mesh networks, low power wide area (LPWA) and satellite.”
M2M wireless terminal sales are expected to more than double in revenue terms in the period to 2019.
These products are much more diverse and can cost from $150 up to $2,000 for complex multi-radio gateways.
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Independent Board Members: The Outsiders With an "In"
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Mythbusters Tests Killer Drones
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CERN Taps Brocade For SDN
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Windows 10 Mobile: Why Microsoft Is Confident
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Samsung SE370 Monitor Boasts Wireless Charging Capability
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Smarter Sensor Hub Cuts Power
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Server power measured per programme
Aiming to cut power waste in data centres, Fujitsu Labs has developed a way to determine how much energy each programme running on a CPU consumes.
It adds to the capability, called RAPL, of some Intel CPUs to measure overall power consumption.
“According to a report by the Japanese Ministry of Internal Affairs and Communications, Japan’s datacenters consume an average of 7.72 billion kWh per year,” said Fujitsu. “One way to reduce energy consumption is through the use of more energy-efficient hardware. Another is to reduce the energy required to run programs on servers. A precondition for energy-efficient programming is to have an understanding of the energy being consumed by existing software. Until now, however, it was not possible to calculate the energy required to execute software on a core-by-core basis, so it has been difficult to take a software-based approach to reducing power consumption.”
Not a lot of detail has been revealed – it is to be presented at the Summer United Workshops on Parallel, Distributed and Cooperative Processing 2015 (SWoPP 2015) next week.
The Lab’s technique uses information that can be tracked at the individual core level such as clock cycles and cache-hit percentages to estimate energy consumption in detail, down to the program module level. It adds atound 1% processing over-head, and captures information by the millisecond.
Testing is underway, a practical implementation is expected in 2016, and the company is also looking into applying the technology to its own data centres.
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IQE joins Obama initiative
IQE has been announced as a key partner in a new consortium to establish the United States’ first Integrated Photonics Institute for Manufacturing Innovation (IP-IMI).
Created as part of President Obama’s National Network for Manufacturing Innovation (NNMI), the IP-IMI was launched this week in Rochester, NY by US Vice President Biden as the sixth of nine new manufacturing institutes designed to bring industry together with academia and government to advance the state-of-the-art in the design, manufacture, testing, assembly, and packaging of photonic integrated circuits and establish US Leadership in Integrated Photonics.
“IQE is proud to have been named as one of 55 key industrial partners in this important project led by SUNY to accelerate photonic capabilities and manufacturing in the U.S,” says IQE CEO Dr Drew Nelson, “the importance of the rapidly growing photonics technology industry cannot be overestimated and is already having a major impact in areas such as communications, energy efficiency, healthcare and safety and security systems. Inclusion as a key partner in this new US Manufacturing Institute is testament to IQE’s reputation as a global world leader in compound semiconductor materials, a key enabling technology (KET) for photonics.”
The consortium comprises 55 leading industrial partners, including Intel, IBM, Infinera, HP, Honeywell, Rockwell, Seagate and TI along with numerous other leading edge companies, universities and laboratories, and is led by the Research Foundation of the State University of New York (SUNY). IQE’s role in the consortium is to provide advanced epitaxy services to the Institute partners.
The IP-IMI has been awarded federal funding of $110 million by the Department of Defense, which is expected to yield total public-private investment of more than $610 million which will enable the institute to focus on developing an end-to-end integrated photonics ecosystem in the U.S., including domestic foundry access, integrated design tools, automated packaging, assembly and test, and workforce development. The Institute will develop and demonstrate innovative manufacturing technologies for:
Ultra-high-speed transmission of signals for the internet and telecommunications
New high-performance information-processing systems and computing
Compact sensor applications enabling dramatic medical advances in diagnostics and treatment
Multi-sensor applications including urban navigation, free space optical communications and quantum information sciences
Other diverse military applications including electronic warfare, analog RF sensing, communications, and chemical/biological detection
All of these developments will require cross-cutting disciplines of design, manufacturing, packaging, reliability and testing.
Photonics is widely recognised globally as a key enabling technology that has significant potential to revolutionize a wide range of commercial, industrial and defense applications, including:
Revolutionizing communications
Creating dramatic energy savings at high-performing data centres
Dramatically improving medical technologies
Improving safety and security operations
The institute will provide central facilities through which academia, SMEs and large corporations can access latest technology for design and manufacture of photonics devices providing a route to commercialisation through high-value, high-volume manufacturing.
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Agile Design for Hardware, Part II
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Infineon on-track to 34% y-o-y growth
Infineon had calendar Q2 revenue of € 1,586 million – up 7% on calendar Q1 – for a profit of €245 million at a margin of 15.4%. Infineon expects a 1% revenue increase in calendar Q3 and a 34% increase for the full year.
“Revenue, earnings and margin rose significantly in the quarter, despite an increasingly difficult business environment,” says Infineon CEO Reinhard Ploss, “for the full fiscal year, we therefore continue to forecast revenue and a Segment Result Margin within the ranges previously predicted. The integration of International Rectifier is progressing according to plan.”
Between its four main operating units, revenues split: Automotive €621 million, Industrial Power Management €269 million, Power Management and Multimarket €517 million and ChipCard and Security €172 million.
Overall group operating income improved from €79 million in calendar Q1 to €119 million in calendar Q2 while net income for calendar Q2 came in at €109 million, well ahead of the previous quarter’s €65 million.
Payment of the purchase price for International Rectifier had given rise to a negative Free Cash Flow of €1,880 million in calendar Q1.
Net cash provided by operating activities from continuing operations rose from €135 million to €432 million. The gross cash position went up from €1,656 million on March 31, 2015 to €1,842 million at the end of calendar Q2.
The net cash position improved over the same period from a negative amount of €176 million to stand at a positive amount of €49 million at June 30, 2015.
With these figures, Infineon is now back within the target range for its three capital management objectives, namely gross cash of between 30 and 40% of revenue, a positive net cash position, and a moderate level of debt.
All four operating segments will contribute to revenue growth in 2015.
Investments during the 2015 fiscal year are expected to be in the region of €800 million. This figure includes investments in plant and equipment at existing factories and in intangible assets including capitalized development costs.
Specifically included in these investments are €60 to €70 million for readying the second shell in Kulim, Malaysia, for volume production and €21 million for the purchase of Qimonda patents in conjunction with the settlement reached with the insolvency administrator of Qimonda AG.
Depreciation and amortization will increase to around €750 million, mostly as a result of acquisition-related charges.
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Toshiba licenses ARM Cortex-A53
Toshiba has licensed the ARM Cortex-A53 processor, the most power-efficient ARMv8-A processor capable of seamlessly supporting 32-bit and 64-bit code.
Toshiba will deploy the processor to develop ASSPs such as ApP LiteT application processors that offer well balanced power-efficiency and performance with 64-bit capability, and custom products such as FFSA (Fit Fast Structured Array) and ASIC for industrial, networking, IoT, automotive and data storage products. The Company expects to bring products to market at an early date.
The industrial market is seeing strong demand for 64-bit capabilities and high reliability. The network market requires high-speed, low-power-consumption operation, real time processing and multi-clustered storage systems[1] for huge data handling and data encryption. IoT products require power-efficient microprocessors, and applications relying on enormous storage capacity need an expanded memory address space. Toshiba will develop products to meet these various demands.
The processor will allow Toshiba to hasten the development of highly featured, high performance systems that meet the functional safety requirements of ISO26262 for the automotive market and to provide customers with solutions for next generation automotive applications.
The Cortex-A53 processor features an 8-stage in-order pipeline, and strengthened data access / instruction fetch techniques. It also features ARM NEON technology with enhanced multimedia handling capabilities in addition to 128-bit SIMD ordering capabilities, as well as a cryptographic engine that accelerates encryption handling such as AES (Advanced Encryption Standard) and SHA (Secure Hash Algorithm) by extending architectures.
“Toshiba’s commitment to build SoCs based on Cortex-A53 further highlights the diverse range of use cases for the industry’s leading low-power 64-bit processor,” said Nandan Nayampally, vice president, marketing, CPU group, ARM. “The Cortex-A53 will deliver new levels of compute performance into power and space constrained environments in automotive, IoT and networking infrastructure applications and the processor safety package enables Toshiba to create products compliant with the latest functional safety standards.”
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Plessey goes into LED light bulb ‘filament’ production
Plessey has launched a range of LED ‘filaments’ based on GaN-on-Si die made in Plymouth.
“The filaments are designed for the surging filament bulb market where these replacement lamps have far better performance, but maintain the physical appearance of incandescent lamps,” said the firm.
Called the PLF series, the chip-on-board filaments create the same amount of light as an incandescent filament, while consuming less energy and lasting longer.
Terminations are unique, said Plessey, as they can be handled and spot welded by existing high volume automated glass lamp manufacturing lines, and the firm has incorporated a mechanism to control current and Vf of the filaments when filaments are driven in a bridge configuration.
“Plessey will also be incorporating other active and passive electronic components for chip-on-board and chip-scale packaging solutions in next generation of filaments,” said company CTO Dr Keith Strickland.
‘PLF’ series filaments come in a variety of lengths, light outputs, with colour temperatures from very warm 2,200K to sunlight-cool 6,500K.
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Asia Tech Image to ship CIS modules to China-based ATM maker
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Taiwan, China firms to jointly set up cloud-based educational platform
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Young Optics to start production of industrial optical modules for ultra-slim surveillance devices
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Low order visibility for 2H15, says SPIL chairman
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Innolux reports 2Q15 performance
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Digitimes Research: Taiwan 2Q15 LCD TV shipments decline 8% on year
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Digitimes Research: Taiwan 2Q15 small- to medium-size panel shipments drop 0.4%
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Worldwide tablet market continues to decline; vendor landscape is evolving, says IDC
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High-end graphics cards become new focus for vendors
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Delta Electronics starts integration of Norway-based Eltek
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WearWise unveils new wearable camera
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Wistron chairman expresses concerns about China supply chain takeover
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Taiwan IC firms positive about demand for USB 3.1 Type-C solutions
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QuickLogic introduces multi-core EOS sensor hub
QuickLogic has introduced a triple core sensor hub called EOS.
The justification for sensor hubs is that: “It is power-prohibitive to do sensor processing on the host processor,” according to QuickLogic vice-president Brian Faith.
The three cores are: an ARM Cortex M4F MCU, a front-end sensor manager and a QuickLogic proprietary core which it calls Flexible Fusion Engine (FFE). A fourth core could be integrated into the hub’s FPGA fabric.
The FFE and and sensor manager handle the bulk of the algorithm processing, which minimises the duty cycle for the floating point MCU.
This approach lowers aggregate power consumption, and enables mobile, wearable and IoT device designers to introduce next generation sensor-driven applications, such as pedestrian dead reckoning (PDR), indoor navigation, motion compensated heart rate monitoring, and other advanced biological applications within their power budgets.
The EOS platform includes a hardened subsystem specifically designed for always-listening voice applications.
With its dedicated PDM-to-PCM conversion block, and Sensory’s Low Power Sound Detector (LPSD) technology, the EOS system enables always-on voice triggering and recognition while consuming less than 350 microAmps.
“It solves the problem of doing voice recognition at low power,” says Faith.
EOS has 2,800 effective logic cells of in-system reprogrammable logic that can be used for an additional FFE or customer-specific hardware differentiated features.
The EOS S3 platform and QuickLogic’s SenseMe library are compliant with Android Lollipop (5.0+) as well as various RTOSes.
Since the platform is sensor and algorithm agnostic, it can support third party and customer-developed algorithms through QuickLogic’s industry-standard Eclipse Integrated Development Environment (IDE) plugin.
The IDE provides optimised and proven code generation tools as well as a feature-rich debugging environment to ensure quick porting of existing code into both the FFE and the ARM M4F MCU of the EOS S3 platform.
Applications include:
- Always-on, always-listening voice recognition and triggering
- Pedometry, pedestrian dead reckoning, and indoor navigation
- Sports and activity monitoring
- Biological and environmental sensor applications
- Sensor fusion including gestures and context awareness
- Augmented reality
- Gaming
Processor Cores
- 180DMIPS of aggregate processing capability
- 578KB of aggregate SRAM for code and data storage
QuickLogic Proprietary microDSP Flexible Fusion Engine
- 50KB SRAM for Code
- 16KB SRAM for Data
- Very long instruction word (VLIW) microDSP architecture
- 50µW/MHz
- As low as 12.5µW/DMIPS
ARM Cortex M4F
- Up to 80MHz
- Up to 512KB SRAM
- 32-bit, includes floating point unit
- 100µW/MHz; ~80µW/DMIPS
Programmable Logic
- 2,800 effective logic cells
- Capable of implementing an additional FFE and customer-specific functionality
Package Configurations
- Ball grid array (BGA)
- 3.5×3.5×0.8mm, 0.40mm ball pitch
- 49-ball, 34-user I/O’s
Wafer Level Chip Scale Package (WLCSP)
- 2.5×2.3×0.7mm, 0.35mm ball pitch
- 36-ball, 28-user I/O’s
Integrated Voice
- Always-on voice trigger and phrase recognition capability, in conjunction with sensory
- I2S and PDM microphone input with support for mono and stereo configurations
- Integrated hardware PDM to PCM conversion
- Sensory low power sound detector (LPSD)
Interface Support
- To host – SPI slave
- To sensors and peripherals – SPI master (2X), I2C, UART
- To microphones – PDM and I2S
Additional Components
- ADC
- 12-bit sigma delta
- Regulator – low drop 0ut (LDO), with 1.8V to 3.6V input support
- System clock – integrated 32kHz and high speed oscillator
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2015年7月29日 星期三
Getac launches new ruggedized tablet with improved gear
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GCL-Poly Energy has no plans to produce solar cells
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China Internet user base over 667 million at end of June 2015, says CNNIC
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Motorola launches 3 smartphones
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Taiwan market: TWM, FET maintain monthly price of NT$998 for unlimited 4G use
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Corning announces 2Q15 core sales of US$2.5 billion
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China imports 10,942 tons of polysilicon in June
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PC replacement pushed by Windows 10 may come slowly, say Taiwan makers
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UMC expects wafer shipments to drop in 3Q15
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Silicon Motion expects to deliver another year of record sales
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Testing service provider Sporton reports strong 2Q15 earnings
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HTC to make investment in VR application provider WEVR
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Tsunami of M&A deals underway in 2015 chip industry, says IC Insights
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EEVblog #773 – 80W INDUAL LED Light Teardown
Teardown of the new INDUAL 80W industrial LED high bay ceiling light from Lightinstar
In particular a close-up look at the 150W 12×12 Chip-On-Board COB LED module from HongliTronic
Datasheet
UPDATE: Yes, they say they have fixed the issues of mounting and earthing.
Forum HERE
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eBook Explains Faster In-System Flash Programming
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What's Next for Wearables?
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Quantum Computing: Diode-like Breakthrough Surmounts Roadblock
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There's No Shame in ReRAM
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Chinese Automotive Chip Market Continues Rapid Growth
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UMC Cuts Expectations for 28nm Ramp on Weaker Demand
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In depth: NASA’s passive Wi-Fi saves 80% power
NASA has revealed a technique which dramatically cuts the power consumption of Wi-Fi comms, at least at the remote terminal.
Key is modifying the Wi-Fi base station to allow the transmitter of the remote terminal to be replaced by a modulated passive reflector.
“In a Wi-Fi radio, 70-80% of power is consumed generating Wi-Fi signal. If you only reflect, you save the transmit power,” Adrian Tang of NASA’s Jet Propulsion Laboratory told Electronics Weekly. Tang is working with Frank Chang at UCLA.
What returns to the basestation is not some pale shadow of Wi-Fi.
“You get PHY, header, and everything; you get real Wi-Fi comms back,” said Tang.
The scheme works like this:
The basestation is modified to emit a 20dBm continuous-wave (CW) sinewave at the Wi-Fi fundamental frequency, while the remote terminal has an antenna connected to a variable phase shifter and a load.
Even without the phase shifter, the remote terminal can amplitude-modulate reflected signals by switching the load between matched and short-circuit.
With the right phase shift options, the signal reflected back from the antenna can be a clean Wi-FI signal with modulation up to 16-QAM – and phase shifters can be as simple as switches connecting the antenna to transmission lines of various lengths.
Tang and Chang have implemented such a modulator, offering QPSK and ASK as well as covering 2.4 or 5.83GHz, on a CMOS chip – its 200µm2 footprint is small enough to be added to a baseband SoC.
“At the remote terminal, there is no synthesiser, no power amplifier, just a modulator; and the modulator is just a bunch of switches,” said Tang.
For the demonstrator, the chip also includes a pseudo-random number generator.
The basestation has a conventional Wi-Fi receiver chip, but it needs some help.
Its receive antenna gets the smaller-than-usual modulated, swamped by reflections of the original CW signal from the local environment – putting reception well outside the dynamic range of conventional Wi-Fi chip front-ends.
To get over this, Tang and Chang have created a second chip (see photo) from 65nm CMOS which sits between the basestation receive antenna and the conventional Wi-Fi chip.
At the receive antenna, all the local CW reflections add to a single CW signal of arbitrary phase and amplitude.
The second chip takes a sample of the transmitted CW signal and, via a variable phase shifter and a variable attenuator (right in the photo), adds it to the received signal.
With the correct phase shift and attenuation, most of the incoming CW signal can be nulled, leaving the Wi-Fi signal. And the correct values are controlled by feedback loops in an on-chip signal processor which updates the phase and amplitude settings every 100µs.
“We can get about 60dB of suppression. We don’t actually need it all. We only need to stop the receiver from compressing,” said Tang. “10-20dB is good enough for a normal Wi-Fi chip.”
In the photo, the central block is the signal processor. The right-hand circuit samples the CW transmit signal. Its two horizontal structures are the variable phase shifter above the variable attenuator. On the left hand side is the antenna interface circuit.
So far, the scheme has been tested at up to 6m, and 330Mbit/s has been achieved at 2.5m range.
One fly-in-the-ointment is that Wi-Fi basestations are not permitted to transmit CW signals.
“We are working to make it 100% Wi-Fi standard compatible,” said Tang.
Patents have been applied for, and applications in wearables are expected. “There are agreements in place for the commercialisation of the technology,” said NASA.
The technology came out of a NASA project to eliminate mechanically-steered antennas in space – whose pivots have a habit of seizing, according to Tang.
One option is beam-forming using a fixed planar array of antennas, each driven by a separately phase-shifted signal through its own power amplifier, or low-noise amplifier (LNA) in the receive case.
As an alternative, NASA is experimenting with a single power amplifier and fixed antenna, bouncing its energy off a fixed planar array of reflective antennas, each with its own variable phase-shifter to steer the beam. If it works, it will cut out the need for multiple power amplifiers or LNAs.
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Concept upgrades netlist debugger for complex SoCs
German chip debugging tool firm Concept Engineering has released its latest generation tools.
StarVision PRO, RTLvision PRO, GateVision PRO, and SpiceVision PRO are scriptable debugging and visualisation tools.
As well as a debug tool for analogue, digital and mixed-signal designs, StarVision PRO provides customisable design rule checks and automated netlist pruning.
There is an RTL debugger, RTLvision PRO, and GateVision PRO can be used for netlist debugging of more complex SoC netlists.
For SPICE simulation, the SpiceVision PRO can be used to view and debug transistor-level and post-layout netlists.
“With version 6, we continue to improve our specialized product family with individual tools for specific circuit debugging problems,” said Pascal Bolzhauser, product manager for Concept Engineering′s Vision product line.
Other features include:
- StarVision PRO now also allows netlist pruning for the most common post-layout formats, DSPF and SPEF.
- Improvements in the database API and GUI API allow even more sophisticated code to be developed and executed by the tool.
- Enhanced batch processing capabilities allow more efficient processing of user-defined analysis and debugging tasks.
- Unified File Open Dialog to load complex mixed-language SoC designs and libraries.
Version 6.0 products are available now to download from the company′s website. There are no additional fees for existing customers with valid licenses.
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Metallic Nanoparticles May Lower Solar Cost
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Design kit for STM32F7 MCU has Arduino extension
STMicroelectronics’ STM32F7 series ARM Cortex-M7 core microcontroller just got easier to design in with a starter kit that has a Arduino Uno connector for coupling into the open source design environment.
Dubbed the Discovery kit, it comes with a 4.3-inch WQVGA colour LCD with touchscreen.
There is a 128Mbit Quad-SPI flash memory interface, 128Mbit SDRAM and interfaces for a micro SD card socket, Ethernet and USB OTG HS connector.
There are audio inputs and outputs, a camera connector and MEMS microphones.
The kit is available from distributor Rutronik which is also selling two versions of the STM32F7 MCU evaluation board. The STM32746G-EVAL2 and the STM32756G-EVAL2 with hardware cryptography acceleration.
The evaluation boards have a 5.7-inch touchscreen, 32Mbyte SRDRAM, the camera module and the RTC with backup battery.
The STM32F7 MCU with on-chip accelerator achieves 1082 CoreMark at 216MHz.
A version of the MCU, STM32F756, incorporates a crypto/hash processor providing hardware acceleration for AES-128, -192 and -256 encryption with support for GCM and CCM, Triple DES, and hash (MD5, SHA-1 and SHA-2) functions.
The series can be ordered at distributor Rutronik in seven different packages with 100 to 216 pins and as small as 4.5 x 5.5mm in WLCSP.
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Multi-layer security needed for Industrial IoT
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Intel, Micron plan crosspoint memory
Intel and Micron plan to have samples of a 128Gbit 3D crosspoint memory by the end of the year with commercial shipments in 2016.
Intel claims that the new memory, which it calls XPoint, writes ‘up to 1000 faster than NAND’ and has 1000 times the endurance of NAND.
The memory has a cross point array structure described, in the press release, as a “3D checkerboard where memory cells sit at the intersection of word lines and bit lines, allowing the cells to be addressed individually. As a result, data can be written and read in small sizes, leading to faster and more efficient read/write processes.”
The release adds:
“More details about 3D XPoint technology include:
Cross Point Array Structure – Perpendicular conductors connect 128 billion densely packed memory cells. Each memory cell stores a single bit of data. This compact structure results in high performance and high-density bits.
Stackable – In addition to the tight cross point array structure, memory cells are stacked in multiple layers. The initial technology stores 128Gb per die across two memory layers. Future generations of this technology can increase the number of memory layers, in addition to traditional lithographic pitch scaling, further improving system capacities.
Selector – Memory cells are accessed and written or read by varying the amount of voltage sent to each selector. This eliminates the need for transistors, increasing capacity while reducing cost.”
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Touch displays need extra EMI protection, says supplier
Capacitive touch screen panels have their own particular problems with being susceptible to electromagnetic interference (EMI)
EMI coupling for capacitive touch screens can be a problem which can result in the touch screen assembly being affected by external noise and emissions from the rest of the system.
As well as the system’s power and data processing functions, the display and associated electronics which may also emit EMI.
To address the issues of EMI in capacitive touch panels, display module supplier andersDX is now using customised driver ICs that have EMI specific filter circuits.
Mike Logan, display and input technology manager at andersDX said:
“Engineers understand that EMC needs to be tackled from the ground up. Capacitive touch screens are sensitive to EMI and protection can’t be added as an afterthought.”
These techniques will need to be applied on a case by case basis taking into account multiple factors and in particular the environment and the design of the host product.
“There is no one-size-fits-all solution here. We will work with customers from initial concept right through to qualification, to ensure that the display works reliably in their application, doesn’t interfere with other systems in the environment and complies with the required standards,” said Logan.
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Taiwan IoT makers have to develop innovative applications, says Acer founder
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MediaTek 3Q15 sales likely to rise 15-20%
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Quantum dot market to grow at CAGR of 30.4% during 2015-2020, says research firm
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Windows 10 available in 190 countries as free upgrade
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TPK reports 22% on-year decline for 2Q15
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Intel and Micron claim breakthrough memory solution
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China Internet service company plans to invest in HTC, claims report
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Intel defines 6 desktop market segments for CPU platforms, say Taiwan makers
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China IC backend firms reportedly obtain orders from Qualcomm, MediaTek
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Taiwan market: Xiaomi to focus on mid-range to high-end smartphones
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AUO expects weak panel demand in 2H15
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Telecom carriers expected to play key role in IoT, says CHT president
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China adds PV installation capacity of 7.73GWp in 1H15, says NEA
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Flat panel display revenues forecast to fall in 2015, says IHS
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The number of natural gas refueling stations is expected to reach nearly 39,000 by 2025, says firm
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2015年7月28日 星期二
Demand for UV-A LED may take off in 2015, say Taiwan makers
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Digitimes Research: Taiwan makers to see flat growth for large-size panels in 2H15
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Taiwan market: Samsung unveils Galaxy Tab S2
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PTI looks to moderate growth in 3Q15
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Inotera raises capex for 2015
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Chinese automotive semiconductor revenues to hit US$6.2 billion in 2015, IHS says
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Chipbond to boost sales from non-driver ICs, says report
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China market: Meizu to start marketing fast mobile chargers, says report
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Demand for Radar Systems Boosts Infineon's Chip Production
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Intel, Micron Launch "Bulk-Switching" ReRAM
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Chips in Space -- MacSpace, A Record Throughput Multi-Core Processor for Satellites
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Smart Meters Can Destabilize Grid, Study Says
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Rohm Semiconductor Acquires Powervation
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Ams Buys NXP Sensor Business
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IoT Accelerators Offer Advice to Entrepreneurs
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Electronic Design’s Products of the Week (7/26-8/1)
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