2015年5月31日 星期日

ARM produces mbed Cordio IP block

ARM has produced a hardware subsystem for IoT designed for use with Cortex-M processors and mbed OS using Cordio Bluetooth Smart radio.

It is possible to integrate other radios such as Wi-Wi and 802.15.4.

ARM IoT for ARM Cortex-M processors is an individually licensed IP block that works in conjunction with other ARM processor designs, allowing manufacturing partners to integrate sensors and other peripherals to create full SoCs.

Optimised for production using the TSMC 55ULP manufacturing process, mbed SoCs made on the process should operate at under 1W.

The idea behind the block is to give developers an end-point to integrated sensors and other peripherals for SoC design.



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IC demand for PCs remains slow

IC orders for PCs have remained slow thus far in 2015, whereas orders for handsets and consumer electronics devices are picking up prior to the third quarter peak season, according to sources at Taiwan-based IC design houses.



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Osram wins preliminary judgment on LED latent infringement charge against Asustek

Osram has announced a local court in Dusseldorf, Germany has made preliminary judgment that Taiwan-based IT vendor Asustek Computer infringed its German patent, DE 196 55 185, for the white-light LED used in Nexus 7 tablet.

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Global TV panel shipments to reach record of 265 million units in 2015, says IHS

TV panel shipment targets will reach a historic high in 2015, despite the strengthening dollar against other currencies, especially those of the Commonwealth of Independent States (CIS) and emerging markets. According to IHS, TV panel unit shipments are expected to grow 5% on year, reaching a record 265 million units in 2015. The total panel area for TV display shipments is expected to increase 9% in 2015 over the previous year.

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EU starts anti-circumvention investigation of Taiwan solar firms

The European Commission on May 29 announced an anti-circumvention investigation of China-, Taiwan- and Malaysia-based makers of crystalline silicon solar cells and PV modules.

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Formosa Plastics developing dye-sensitized solar cells, says paper

Taiwan-based petrochemical firm Formosa Plastics is developing dye-sensitized solar cells (DSSCs) for use in consumer electronics, handset power supply and residential lighting, according to Chinese-language newspaper Economic Daily News (EDN).

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BenQ returns to Computex after 8-year absence

BenQ, a Taiwan-based IT product, consumer electronics and LED lighting vendor belonging to the AUO-BenQ Group, will return to the Computex Taipei 2015 after being absent for eight years, according to company president & CEO Conway Lee.

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Taiwan FPCB makers facing increasing competition from Japan for iPhone orders

Taiwan-based flexible (FPCB) makers in the iPhone supply chain are likely to be forced to lower their prices in order to fend off competition from Japan-based rivals for securing more orders from Apple, according to industry sources.

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GIGABYTE delivers Cavium ARM-based server boards

GIGABYTE of Taiwan has produced a cache-coherent, dual socket ARM server board the MT70-HDO and its associated 2U rackmount the H270-T70.

Based on the Cavium ThunderX ARMv8 processor, they accelerate GIGABYTE’s recent efforts to bring ARM-based server products to market thereby opening new doors for scale-out server workloads.

Designed for the 48 cores ARMv8 2.5GHz ThunderX processor, the MT70-HD0 is a dual socket motherboard built with the same half-width format used in the existing GIGABYTE 2U – 4 nodes blade servers and in the company’s Open Rack systems.

Each server node combines up to  96 cores with up to 1TB of high speed 2400MHz DDR4 memory, two 40Gb/s LAN ports directly controlled by the SoC processors, and full IPMI based remote board management capabilities.

Low SoC TDP combined with high end onboard memory and networking enables a platform with enormous potential for operators of core-intensive applications looking for uncompromised performance and significant power savings simultaneously.

The H270-T70 is a 2U – 4 nodes rackmount using one MT70-HD0 board per blade to house 384 ARMv8 cores in total. Built with a redundant power supply system and a fan-based cooling system serving the four nodes, the rackmount is built with a high efficiency thermal and energy design complementing the power saving aspect of the ThunderX processors.

With two different versions providing front and rear access to the nodes, this server is designed with the flexibility to deliver high-performance compute or balanced compute and storage acceleration for the most demanding applications in big data, large-scale web and virtualization domains.

“We have already developed and released ARM based products oriented toward lightweight workloads and storage applications,” says GIGABYTE’s Alex Liu, “but now with the MT70-HD0 and the H270-T70, we are adding the industry’s first cache-coherent two-socket ARM platform to our portfolio using Cavium ThunderX processors, enabling a solution suitable for datacenter grade workloads. We have already begun initial shipments of these systems.”

“We delivered ThunderX ARMv8 SoCs with up to 48-cores, integrated accelerators and Ethernet fabric, designed for optimal performance and TCO for workloads including cloud, big data and large-scale web, “ says Cavium’s Steve Cumings.

The MT70-HD0 and the H270-T70 will be both available for volume shipment in the third quarter of 2015.



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USB Oscilloscopes from Pro to Hobbyist

These 17 companies offer two and four channel oscilloscopes at prices from less than $100 to nearly $10,000.

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2015年5月29日 星期五

Apple Buys into Augmented Reality -- for Cars?

Munich-based augmented reality software vendor Metaio GmbH has been acquired by Apple. The move fuels anew speculations around Apple's plans to enter the automotive market.

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Google Gestures at 60 GHz

Google unveiled a radar-on-chip for fine gesture control with the goal of expanding increasingly small screens and interfaces. While the radar technology isn't yet authorized by the FCC, Google's ATAP team wants to fine tune its Soli chip for wearables.

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Google Unveils Smart Fabric Program

In what might be the largest development in smart fabrics, Google announced a project to scale manufacturing of fabrics that use broad gestures to control mobile devices, lights, and more.

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Extraction Challenges Grow in Advanced Nanometer IC Design

Successive generations of foundry process technologies enable ever-increasing design density, performance, and power savings, if only designers can deal with growing challenges.

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Can Analog Circuits Inspire Budding Engineers?

Let's face it: when most students looking think about what "electrical" engineers work on - to the extent they do so at all - they think software, programming, apps, and similar. Designing circuits (what we colloquially and misleadingly refer to as "hardware") is unlikely to fit into their perception. If they think of electronic circuitry at all, it's probably just processors and memory. It's a good bet that analog circuits and components don't enter into their mental image at all.

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Sensor Data Analytics -- Unlocking Value in 'Big Data'

With data flowing from ubiquitous sensors, the new field known as sensor data analytics, or SDA, is beginning to show its ultimate promise.

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Robots cope with unforeseen injuries

Wyoming limping robotRobots can pre-learn strategies for future unpredicted injuries, claims a French-US team, and cope even when the nature of the damage is unknown.

The process is two-step, and dubbed ‘intelligent trial and error’.

Step one is performed once for each type of robot: Computer modelling techniques are used to try a huge number of possible behaviours and rate them – in the research case: leg movements rated against the forward speed they produce.

The most successful strategies – hundreds of them – are stored for future reference in a multi-dimensional map.

This map is now a resource, given to every physical robot of the modelled type.

Damage is not detected by sensing, for example, locked leg joints. Instead, it is deduced when the current walking behaviour no longer yields the forward speed it once did.

When this happens, step two is initiated.

The damaged robot tries the most successful of the stored simulated strategies – even though they were simulations of a fully functioning robot.

“A key assumption is that information about many different behaviours of the undamaged robot will still be useful after damage, because some of these behaviours will still be functional despite the damage,” said the team in a Nature paper: ‘Robots that can adapt like animals‘.

Unsuccessful strategies – those which result in slow movement or move in the wrong direction – are discarded. When it finds a strategy that is more successful, it searches the map – updating it from recent experience as it goes – for similar strategies that were even more successful in simulation.

Eventually, it determines further tries are unlikely to provide improvements and stops searching.

Recovery gaits were three to seven times more efficient than the reference gait after damage.

Using the map avoids trying millions of behaviours that were likely to fail, and searching it strategically rapidly finds something that works.

“Each behaviour it tries is like an experiment and, if one behaviour doesn’t work, the robot is smart enough to rule out that entire type of behaviour and try a new type,” said Antoine Cully of the Pierre and Marie Curie University in France. “For example, if walking mostly on hind legs does not work well, it will next try walking mostly on its front legs. What’s surprising, is how quickly it can learn a new way to walk. It’s amazing to watch a robot go from crippled and flailing around to efficiently limping away in about two minutes.”

The university, part of the Sorbonne, worked with the University of Wyoming.

According to the team, it can also allow a robot to adapt to unforeseen situations, a new environment perhaps, or improve its undamaged behaviour. Initially given a hand-crafted walking gait, the research hexapod improved its own undamaged forward speed by 30% using the technique.

Intelligent trial and error has proved versatile, also working on a multi-jointed robot arm that had to drop a ball into a cup.

The all-important map in the first step is created with a new type of survival-of-the-fittest evolutionary algorithm called ‘MAP-Elites’ – read the paper for an understanding of this process. Adaptation in the second step involves a ‘Bayesian optimisation’ algorithm that takes advantage of the prior knowledge provided by the map to efficiently search for a behaviour that works.



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Intel/Qualcomm: The Last Big Move

In the chip game, two big dominoes are waiting to fall.

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Can Formula E Overtake Formula One?

The Formula E race in Berlin was marred by the winner of the race, Lucas de Grassi of the Audi Sport ABT Team, later being disqualified after an inspection of his car reveal he was using non-standard parts.

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Phone apps could equal conventional eye tests for remote communities

Eye test 5x5 EUK researchers have used a phone app to test eyesight in Kenyan homes, and found it as good as conventional eye chart test in a clinic.

The test – called Peek (portable eye examination kit) Acuity – has been developed by the London School of Hygiene & Tropical Medicine, the University of Strathclyde and the NHS Glasgow Centre for Ophthalmic Research.

This is not a test to determine what glasses someone requires, but simply how good their eyesight is – with or without the glasses they normally wear.

To avoid language difficulties, the test uses a single ‘E’ made from a 5×5 matrix (see image) presented at different sizes and rotations of 0, 90, 180 or 270°.

Holding it 2m away from the subject – a distance chosen to be available inside a typical rural Kenyan home – the subject simply has to point in the same direction as the prongs of the E each time it is presented.

To record the subject’s response, the operator swipes the screen in the direction pointed. To avoid operator bias, the operator works from behind the phone – in this case a Samsung phone running Android.

Access to the phone’s light sensor allows the app to warn if ambient light is too bright for the test to be valid.

Peek RetinaFor the project, tests were done in or near the subject’s house, and at a mobile eye clinic.

“The research shows results from the app carried out on 233 people in their own homes and repeated in eye clinics based in Kenya were as reliable as those from standard paper-based charts and illuminated vision boxes in an eye clinic,” said the researchers.

The average difference between home test with the app and illuminated chart clinic tests were equivalent to less than one line on an eye chart.

Tests also showed people can be trained to operate Peek Vision accurately, without being heath care professionals.

“Our ultimate hope is that the accuracy and easy to use features of Peek will lead to more people receiving timely and appropriate treatment and be given the chance to see clearly again,” said Dr Andrew Bastawrous of the London School, and co-founder of an organisation called Peek.

Full results are available free from the journal JAMA Opthalmology.

Peek Retina in usePeek is working on a series of apps to test other eye-related issues – colour vision, contrast perception and retinal health are amongst them. To go with the last one, a clip-on retinal microscope for phones called Peek Retina is under development, which is the subject of an Indiegogo fund-raising campaign

Accurate  are amongst those under development.

Peek has an Indiegogo campaign

http://ift.tt/1SGjpBh

 



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Nanotech researchers come to Birmingham event

Professor Jackie Ying

Professor Jackie Ying

Nanotechnology researchers from around the world will gather at Birmingham City University’s City Centre Campus next month for a two-day conference.

Called “Advances in nanotechnology 2015“, the conference and workshops will discuss the manipulation of matter on an atomic, molecular, and supramolecular scale in medicine and healthcare, nanomechanics and industrial applications of graphene.

Speakers at the event on June 9th include Professor Toshio Fukuda from Nagoya University in Japan and Professor Jackie Ying from Massachusetts Institute of Technology (MIT) in America.

Dr Mohammad Sakhawat Hussain, senior member at Birmingham City University’s Faculty of Computing, Engineering and the Built Environment, said:

“The event provides a great opportunity to see and hear of the potential that nanotechnology has to impact on our lives”.

“Professor Toshio Fukuda from Tokyo will be talking about his research into how the ultra-small technology can help to do the thinking for surgeons in operating theatres using Micro and Nano Robots, while Professor Jackie Ying from the internationally renowned Massachusetts Institute of Technology will highlight the possibilities that nanotechnology has to cure cancers.”

Other speakers at the event include Professor Nick Quirke from Imperial College London, Professor Virginia Ayres from Michigan State University and Professor George Pharr from the University of Tennessee.

 

 



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EEVblog #748 – How Do Transistors Work?


Dave explains how BJT and MOSFET transistors work at the silicon chip level.
How does a BJT transistor actually amplify current?
P and N type doping, charge carriers, conduction channel, field effect, holes and electrons, all the other good stuff.

Forum HERE



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University takes optical fibre research to market

silica_lathe2_pressThe University of Southampton’s Optoelectronics Research Centre (ORC) is making its next-generation optical fibre available for purchase.

Until now, access to the technology was limited to commercial or academic collaborations.

The new optical fibre will be used in high-power lasers, high bandwidth communications and visible and infrared sensing.

The Southampton research centre is promoting the fibre technology by granting the wider business community access, enabling the evaluation of ORC fibres in products and research programmes at the earliest stages of development.

Professor Sir David Payne, director of the ORC writes:

“We wanted to enable any organisation to get hold of small quantities of a fibre that the ORC has already made or can easily make. As the ORC can now routinely make fibre that far exceeds the capability of fibre commercially available, this service gives external organisations access to usable samples of those fibres quickly and easily. This will enable engineers to see for themselves how these fibres can enhance their system performance and enable new products.”

Fibres that are available for sampling and to purchase include rare-earth-doped fibres with ultra-high dopant concentrations; large mode area fibres; high bend radius fibres; multi-trench fibres; and novel compositions with extreme aluminium or germanium concentrations.

The centre will hold a small range of research-grade fibres in stock for immediate delivery with the range continually adjusted over time to include cutting-edge fibres not commercially available.

Fibres will be supplied for engineering development and research only. Once an application requires volume supply and the market demand is established, the ORC will work with commercial fibre manufacturers to transfer the fibre to production.

 



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31A 200V enhancement-mode GaN FET from Digi-Key

EPC2033 2034 GaN fetEfficient Power Conversion (EPC) has introduced two GaN FETs that handle 31A continuously – the 200V EPC2034 and the 150V EPC2033.

The firm is keen to promote pulse capability, which is 140A for the 200V part, and 260A for the 150V part. Both are 2.6×4.6mm, and can operate with junctions up to 150°C. Typical on-resistance is 7mΩ (200V, 10mΩmax) and 5mΩ (150V, 7mΩmax).

Solder balls are placed (see photo) with a 1mm pitch on one axis. “The wider pitch allows for placement of additional and larger vias under the device to enable high current carrying,” said EPC.

Applications are predicted in dc-dc converters, synchronous rectification, motor drives, LED lighting, industrial automation, and Class-D audio amplifiers.

An evaluation board, EPC9047, includes a half bridge made from two of the 150V transistors and a Texas Instruments UCC27611 gate driver (optimised for this kind of FET), optocouplers and capacitors for supply and bypass – all on 50 x 37mm.

Both FETs and the development board are available from Digi-Key.

Part number VDS RDS(on)
(typ)
QG
(typ)
ID
(pulsed)
Size Price
(1,000 units)
EPC2033 150V 5.0mOhm 10nC 260A 2.6 x 4.6mm $4.25
EPC2034 200V 7.0mOhm 8.5nC 140A 2.6 x 4.6mm $4.37

 



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Cambridge firm shows haptic display which is speaker too

ReduxRedux Labs will demonstrate its haptic touch panel technology in San Jose, California at Display Week, 2015.

Cambridge-based Redux has developed an haptic touch technology which can also provide audio sound without separate speakers.

It will show next week in California a 15-inch demonstrator for its haptic touch technology, called SurfaceSensation, which it hopes will find applications in automotive, computing and consumer markets.

Redux Labs claims its technology uses fewer haptic-touch actuators and is energy-efficient and scalable.

Also the SurfaceSound technology uses the same actuators to provide audio from the display, without micro-speakers and apertures.

The sound is created by inertial audio transducers attached to the glass. The transducers create microscopic bending waves in the surface of the glass.

“New display designs without apertures, bezels and breakage-prone switchgear enable diverse applications in industry, agriculture, healthcare and other markets where robustness, resistance to dust and fluids, and cleanliness are key,” said the company.

Display Week 2015 will take place May 31-June 5 at the San Jose Convention Center, in San Jose, Calif.

 



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China market: Foxconn launches smart electric car rental service

The Foxconn Group has begun offering an hourly-based electric car rental service in a number of major cities in China, including Beijing, Hanzhou and Changzhou, and will extend the service to other cities shortly, according to the company.

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China market: Smartisan to launch 5.5-inch smartphone, say reports

China-based Smartisan Technology will launch a smartphone equipped with Qualcomm MSM8939 processor, 5.5-inch 1080p touch screen and supporting GSM, TD-SCDMA, WCDMA, TD-LTE and FDD LTE, possibly in July 2015, according to China-based media reports.

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Chunghwa Telecom reaches 2.34 million 4G users in 1 year

Chunghwa Telecom (CHT) saw 4G subscribers increase to 2.34 million, accounting for 37.1-37.7% of the total in Taiwan, on May 28, the anniversary of it kicking off 4G operations, according to company president Shih Mu-piao.



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Worldwide tablet growth will continue to slow in 2015, says IDC

Worldwide shipments of tablets and 2-in-1 devices are forecast to reach 221.8 million units in 2015, a decline of 3.8% from 2014, according to the IDC Worldwide Quarterly Tablet Tracker. The new outlook follows two consecutive quarters of declining sales and represents a modest downward revision from the previous forecast of 234.5 million units and 2.1% on-year growth in 2015. While IDC expects overall sales to decline in 2015, some segments of the product category are poised to experience strong growth.

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Flat panel display equipment spending forecast to reach US$9 billion in 2015, says IHS

Revenues for flat panel display (FPD) manufacturing equipment are expected to grow for the third consecutive year to reach US$9.1 billion in 2015, according to IHS. This level of FPD equipment spending, the highest level since 2011, is being driven by new LCD and AMOLED panel factories targeting both large-area TV and smartphone applications.

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Xiaomi to use MediaTek Helio X10 chips for 2 smartphones, says paper

Xiaomi Technology reportedly will adopt MediaTek's Helio X10 (MT6795) 8-core processors in two new smartphones slated for release in the third quarter of 2015, according to a Chinese-language Economic Daily News (EDN) report.

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PC shipments will continue to decline in 2015, says IDC

Worldwide PC shipments are expected to fall by 6.2% in 2015 according to the IDC Worldwide Quarterly PC Tracker. This will be the fourth consecutive year of declining volume as the PC market continues to struggle with competition from tablets and smartphones and generally low demand. The market almost saw stable shipments in mid-2014 as the end of support for Windows XP boosted demand for replacements, but that cycle has passed and been replaced by a reduction in inventory on the supply side as the market awaits the arrival of Windows 10.

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Avago acquisition of Broadcom creates new semiconductor powerhouse, IHS says

Merger activity in the semiconductor industry moved to a new level with the announcement of the agreement for Avago Technologies to acquire Broadcom, according to IHS Technology.

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Lextar expects capacity utilization to rise to 80-90% in 3Q15

Lextar Electronics, which provides LED epitaxial wafers, chips and packaging services, expects its capacity utilization rate to rise from about 80% currently to 80-90% in the third quarter of 2015, according to company chairman David Su.



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Taiwan to talk with EU about PV circumvention probe

The Board of Foreign Trade (BOFT) under Taiwan's Ministry of Economic Affairs (MOEA) on May 28 indicated that it has sent a delegation to Brussels to talk with the European Commission about the EU's plan to start an anti-circumvention investigation of Taiwan-based solar companies.

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China LCD TV vendors plan to procure 27-28 million Taiwan-produced panels in 2015, says CVIA executive

China-based LCD TV vendors plan to procure 27-28 million TV panels worth US$4.5 billion from Taiwan-based panel makers, according to China Video Industry Association (CVIA) vice president Bai Weimin, who is leading an industry delegation to visit Taiwan.

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China April polysilicon imports up 5.8% on month, says CNIA

China imported 10,897 tons of polysilicon in April 2015, increasing 5.8% on month, according to the China Nonferrous Metals Industry Association (CNIA).



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Advantech developing IoT base in northern Taiwan

Industrial computing device maker Advantech is developing an IoT (Internet of Things) R&D and production base in New Taipei City, northern Taiwan. The first phase was completed in 2014 and a 6-story factory building in the second phase is under construction and scheduled to be completed in August 2016, according to company president Charney Ho.

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Avago to buy Broadcom for US$37 billion

Avago Technologies and Broadcom have entered into a definitive agreement under which Avago will acquire Broadcom in a cash and stock transaction that values the combined company at US$77 billion in enterprise value, according to the companies.

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Xilinx working with TSMC on 7nm chips

Xilinx has disclosed the company is working with Taiwan Semiconductor Manufacturing Company (TSMC) on the 7nm process and 3D IC technology for its next generation of all programmable FPGAs, multiprocessor system-on-chips (MPSoCs) and 3D ICs.

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Panasonic to add BLU production lines at plants in Mexico and Brazil

Panasonic has announced it will add new production lines for backlight unit (BLU) manufacturing at its Panamex plants in Mexico and TV-manufacturing plants in Brazil. The plan is expected to help shorten the processing time between order placement and shipments.

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Emerging markets drive worldwide smartphone sales to 19% growth in 1Q15, says Gartner

Worldwide sales of smartphones to end users reached 336 million units, an increase of 19.3% during the first quarter of 2015, according to Gartner. This growth was led by strong smartphone sales in emerging markets (excluding China); the fastest growing regions were emerging Asia Pacific, Eastern Europe, and the Middle East and North Africa. Due to these high-performing regions, the emerging markets achieved a 40% increase in sales during the first quarter of 2015.

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NXP to sell RF power amplifier unit to JAC Capital for US$1.8 billion

NXP Semiconductors has announced an agreement that will facilitate the sale of its RF Power business to China's state-owned Jianguang Asset Management (JAC Capital). Under the terms of the agreement, JAC Capital will pay US$1.8 billion for the business.



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Digitimes Research: Global smartphone shipments in 2015 to reach 1.368 billion units

There will be an estimated 1.368 billion smartphones shipped globally in 2015, growing 13.6% on year, according to Digitimes Research.

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Semi-equipment component maker Calitech debuts on Taiwan ESB

Taiwan-based Calitech, which provides key parts for semiconductor front-end equipment, recently started trading on Taiwan's emerging stock market.

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Comment: Qualcomm, Avago/Broadcom is coming for you

Avago satelliteWatch out Qualcomm, Avago/Broadcom is coming for you. This is the clear message from the agreed $37bn deal which will see Avago Technologies acquire Broadcom.

This has the potential to be the largest and most significant merger in the semiconductor industry since the hiatus of the credit-crunch in 2008/9, perhaps of all-time.

It is no surprise it addresses the communications IC market. Thanks to mobile and now IoT, the communications sector has taken over from desktop computing as the world’s dominant semiconductor market.

What is more surprising is that it is Singapore-based Avago Technologies which is proposing to buy Broadcom. But don’t be fooled by Avago’s apparent ‘lack of glamour’. This is a successful company which knows about acquisitions.

Avago’s revenues are less than Broadcom’s. Perhaps more surprising is that while the Broadcom name is widely known around the business world, Avago has slipped under the radar of most of the business watchers.

But it is the combination of Avago’s secret pedigree with Broadcom’s secret sauce which could be Qualcomm’s undoing.

A merged Avago-Broadcom has only an 8% share of wireless communications IC market, dominated by Qualcomm, with Samsung Electronics and MediaTek following behind.

But there is more to this deal than mobile phone chipsets. It changes the communications chip market in toto.

Qualcomm has had challengers in the wireless chipset market before – TI, ST-Ericsson, MediaTek and of course the ever-present Samsung – but the Avago-Broadcom merger will worry Qualcomm.

The reason is the merged company’s strength in the wireline market as well as wireless. This gives it a strongly growing base to go after Qualcomm’s over-balanced wireless business.

A merged Avago-Broadcom will have 40% of the wired communications IC market, excluding memory.

According to market watcher IHS, its revenues for this category in 2014 were more than five times larger than the next largest supplier, Intel. And the business is growing strongly.

When combined with wireless this jumps the merged Avago-Broadcom to number two in the total communications ICs market. With an overall market share of 14% it is just behind Qualcomm and ahead of Samsung Electronics.

This is why the merged $77bn Avago-Broadcom is a serious challenger to Qualcomm.

According to IHS, the wired communications market is likely you grow faster than the wireless chip market in the next five years.

The five-year compound annual growth rate (CAGR) for wired communications is 7%, leading all other market segments. On the other hand, semiconductors used in wireless communications products is projected to go through a period of weak growth at only 2% CAGR over the next five years, says IHS.

This can only strengthen a merged Avago-Broadcom’s challenge to Qualcomm.

On top of this the merged company can make big cost savings on its supply chains in Asia, the most important communications chip market and a market where both have strong businesses.

Avago knows the power of acquisitions to win market share. Last year it acquired LSI to build its position in the storage chip market.

The combined revenues of the two companies in 2014 exceeds $14bn making it the third-largest semiconductor supplier, trailing only Intel and Qualcomm, if memory integrated-circuit (IC) revenues are excluded.

“The complementary product portfolios of the two companies move them into a powerful position, in both the communications IC market and the storage IC market,” said Dale Ford, vice president and chief analyst for IHS Technology.

The mergers increase the company’s strength in the communications and storage categories. Outside of these two areas, Broadcom has a much smaller presence in consumer electronics and industrial electronics and almost no revenue from other data processing and automotive electronics.



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Japan’s Eidec makes EUV resist that could speed EUV production 10x

A highly sensitive resist which could speed up EUV production by 10x has been developed by Japan’s EUVL Infrastructure Development Centre (Eidec).

This metal oxide-based material is highly sensitive to EUV light with a wavelength of 13.5nm. Because it absorbs EUV radiation more easily than ordinary resists made from organic compounds, the new material will reduce lithographic exposure time and allow chips to be produced 10 times faster than with conventional EUV technology.

With current resists EUV can do 50 wafers an hour, Eidec’s resist could increase that to 500 an hour in conjunction with a powerful enough light source. ASML and Cymer hsve now got thst up tp 80W.

Without EUV, 10nm will require triple or quadruple patterning faking it to the point where it is too expensive to be worth doing commercially.

Process technology leaders Intel, TSMC and Samsung have all said they’ll be producing on 10nm next year, but none of them say how they’ll be doing it.

Intel recently ordered 15 EUV machines from ASML.



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2015年5月28日 星期四

Friday Quiz: Data Communications

Test your knowledge of the OSI 7-layer protocol stack.

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Huawei vs. Xiaomi: China in Microcosm

Huawei's technological prowess in telecom and Xiaomi's agility in China's consumer electronics market illustrate both companies' potential and their weaknesses. Understanding the differences offers a glimpse into the future -- where China is guiding the global electronics industry.

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Thank You, Albert Einstein for GPS

Crazy ideas like time slowing down with velocity or mass bending the curvature of a four dimensional fabric called space-time are critical for GPS to work.

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Google Rolls Android M, IoT OS

Developers were audibly excited by the bevy of improvements and added features on the newest Android release, Android M. Google is unlikely to have satisfied hardware engineers, who may have been hoping for a next-generation device.

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Scale & Scalability -- The Keys to True FPGA-Based Verification

Scalable FPGA-based verification has become a serious alternative to big-box emulation.

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A New Broadcom: The First Cuts

The proposed $37 billion merger of Avago and Broadcom creates the world's sixth biggest chip vendor and promises to save at least $750 million a year within 18 months.

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Micron Bullish On Coming Year

Company president Mark Adams sees poor PC DRAM performance stabilizing in the latter half of 2015 with mobile continuing to perform well, but Micron needs to do some work to regain its leadership in NAND.

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When Did Analog Steal Digital's Mojo?

Name two semiconductor companies whose names begin with the letter T that used to mainly make digital ICs but now think analog electronics is more exciting and remunerative!

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Avago-Broadcom Deal: What's in It for You?

Where is the affinity - or any apparent good vibe - connecting Avago to Broadcom?

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Developer turns Arduino into a frequency synthesiser

Tsunami

Tsunami

Tsunami is a signal generator built on the Arduino platform.

It is the brainchild of Nick Johnson at Arachnid Labs and has secured funding on Kickstarter for its commercial launch. It can be pre-ordered for $60.

The design is based on the Arduino Leonardo module and this combined with a direct digital synthesis (DDS) chip for generating analogue signals.

The board generates frequencies with a 2.5ppm accuracy. It can be used to generate signals – sine, triangle, and square waves – all the way from DC up to around 2MHz.

Output amplitude can be adjusted from 0 to 6V peak-to-peak, and DC offset by up to 2V either side of ground.

The Tsunami can also be used to measure signals> It does not use the Arduino’s ADC, but has its own high speed comparator, allowing it to measure frequency up to nearly 8MHz. A peak detector allows it to measure signal amplitude and there is a phase detector.

By connecting the output of the Tsunami to an analogue filter or an audio amplifier, and using the Tsunami’s input to measure what comes out, it is possible to measure how it responds at different frequencies. The phase detector detects the phase delay, which means you can construct bode plots.

The same basic technique can be used to measure unknown inductors, capacitors, or networks of them.

The DDS has built in support for phase and frequency modulation, and the Tsunami adds on support for amplitude modulation too.

The developer is creating a software library of projects such as building an audio synthesizer, to measure the response curve of an audio amplifier, make a digital theremin and read and write data tapes from classic computers (Commodore, Atari, etc).

“We’ve put a lot of effort into making the Tsunami as simple to use as possible, with an easy to use Arduino library that covers all the Tsunami’s functions. Generating a sine wave, for instance, is as simple as telling the Tsunami what frequency you want,” said the developers.

 

 



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FPGAs Ride HP's Moonshot

SRC Computers announced a new FPGA server card that Hewlett-Packard will sell as an option for its processor-agnostic Moonshot servers.

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NXP Agrees to RF Power Business Sell-Off

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Internet of Things Creates Opportunity Bubble for Analog

The analog devices play a special role in the Internet of Things (IoT) and will have an impact on electronics sales.

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Rohm Buys Renesas Wafer Fab

Rohm Co. Ltd. (Kyoto, Japan) has moved to acquire a 200mm wafer fab from Renesas Electronics Corp. for 450 million yen (about $3.7 million).

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Avago to buy Broadcom

Avago satelliteAvago Technologies has agreed to acquire Broadcom in a $77bn deal.

The deal will create a major supplier communications chips with annual revenues of approximately $15bn.

The combined company will adopt the Broadcom name.

“Today’s announcement marks the combination of the unparalleled engineering prowess of Broadcom with Avago’s heritage of technology from HP, AT&T, and LSI Logic, in a landmark transaction for the semiconductor industry,” said Hock Tan, president and CEO of Avago.

According to Scott McGregor, president and CEO of Broadcom, the deal will give the company access to “a greater breadth of technology and product capability”.

Following completion of the transaction, Avago CEO Tan will continue to serve as president and CEO of the combined company.

Under the terms of the definitive agreement, Avago will acquire Broadcom for $17bn in cash and a share transaction valued at $37bn.

 



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NXP agrees $1.8bn RF sale to fund Freescale merger

Rick Clemmer, CEO NXP

Rick Clemmer, CEO NXP

NXP Semiconductors has agreed to sell its RF power business to Chinese private equity firm Jianguang Asset Management  for $1.8bn.

The sale of the RF power business, which supplies RF power amplifiers to the mobile phone basestation market, seems to have been a element in the proposed merger of NXP with Freescale Semiconductor.

Proceeds from the sale of the RF Power business will be used to partly fund the acquisition of Freescale.

“Although we would have expected a higher valuation in a regular disposal, JAC Capital’s ability to support continued growth and development of the business and its ability to sign and close a transaction rapidly was a key factor in enabling the best outcome for our customers and shareholders, as well as supporting the closure of the merger with Freescale Semiconductor,” said Richard Clemmer, NXP CEO.

Under the agreement, the business and approximately 2,000 NXP employees are to be transferred to an independent company incorporated in the Netherlands, which will be 100% acquired by JAC Capital upon closing of the transaction.

Additionally, all relevant patents and intellectual property associated with the RF Power business will be transferred in the sale, as well the NXP back-end manufacturing operation in the Philippines that is focused on advanced package, test and assembly of RF Power products.

“We are happy to reach an agreement to acquire the RF Power business from NXP with its strong team and established technology. We will keep on increasing investment in R&D, manufacturing and customer service of the new company to strengthen its market position,” said Brighten Li, chairman of JAC Capital Investment Evaluation Committee.

 



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Super-caps for IoT only 0.6mm thick

supercap GW134T SD CardCap-XX has halved the thickness of its supercapacitors – to 0.6mm – aiming them at power-boosting in IoT applications.

The range is called Thinline, conceived while working with a customer designing a disposable insulin pump. “We figured out how to eliminate materials and change some processes to reduce costs and thickness,” said Cap-XX CEO Anthony Kongats.

Many energy sources cannot support high load currents.

Solar, vibration and RF energy harvesters are examples, as are thin-film batteries and coil cells.

A super capacitor can collect energy from weak energy sources over a long time, and supply that charge to a high-current load for a sort time – a wireless transmit burst for example, or for data storage on power fail.

The firm’s supercapacitors store charge in engineered carbon electrodes on aluminium foil. Its previous thinnest capacitor was 1.1mm. “To reduce thickness and manufacturing costs, Cap-XX increased the power and energy density in its electrode materials to deliver equivalent performance in about half the volume, and eliminated the folded edges and copper terminals that contribute to thickness,” said the firm.

CAP-XX Thinline supercapacitors support power requirements in IoT devices including wireless communication (Bluetooth, Bluetooth Smart, Zigbee, Z-Wave, Ant, active RFID), electronic paper and OLED displays, haptic or tactile feedback, vibration alerts, GPS acquisition, and injection or inhalation system delivery.

Cap-XX super-cap electrodesAt a glance

  • from 0.6mm (600µm) thick
  • up to 117kW/litre
  • ESR from 16mΩ, 2x nominal at -40°C
  • 0.8Wh/litre loading
  • up to 2.75V continuous
  • -40 to +85°C operation
  • Leakage typically <1µA
  • Virtually unlimited charge-discharge cycle life
  • Three footprints:
  • ‘A’    19.5 x 20.0 x (0.6-0.9)mm 60-180mF 45-200mΩ
  • ‘W’    28 x 20.2 x (0.6-0.9)mm 100-300mF, 24-120mΩ
  • Cap-XX super-cap electrodesture‘S’     39 x 20.2 x (0.6-0.9)mm 180-540mF, 16-75mΩ

0.7 and 0.9mm cells have higher C/lower ESR and cost slightly more.
Suggested retail price for 0.6mm cells is less than $1 in large volumes.
All parts are available in 2.3V (70°C) or 2.75V (85°C), and can be assembled by soldering or welding (ultrasonic, laser or spot).



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Daimler, Qualcomm Announce Strategic Partnership

Mercedes-Benz brand owner Daimler AG and Qualcomm Technologies have announced a strategic partnership aiming at vehicle connectivity. Initially both companies will together fathom out which technologies will suit best for future vehicle generations. Possible technologies include 3G/4G mobile radio as well as cable-free charging options such as Qualcomm's Halo Wireless Electric Vehicle Charging (WEVC) technology

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Chips Make Change in Emerging Markets

The chief executive of ARM challenges engineers to put today's technologies to use in developing markets.

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Osram takes on CoBs in MR16 lamps

Osram Duris S10Osram is taking on chip-on-board LEDs (CoBs) in MR16 lighting applications with a 7x7mm surface-mount (SMD) array LED named Duris S 10.

“In view of the surface-mounted design of the LED, a pc board has to be incorporated in the luminaire. This opens up numerous design options such as integrating thermal fuses, connectors or driver components on the LED board,” said Osram. “In standard CoB solutions, these functions have had to be accommodated on a separate pc board.”

It comes in 1,050 and 1,400 lumen (typical at 3,000K, 800mA, 85C) versions, both with an effective light-emitting diameter of 7.7mm – allowing narrow beam MR16 spotlights to be created.

CRI is 80, whites range from 2,700 to 6,500K. Operation is 28 or 37V depending on version.

Osram Duris S10 applicationBinning is according to MacAdam ellipses.

 



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UltraScale FPGA board scales to 600 million gates

proFPGA_UltraScale_440_FPGA_moduleUS-based Pro Design has come up with a kit for prototyping Xilinx Virtex UltraScale XCVU440 FPGAs and will demonstrate it at next month’s Design Automation Conference (DAC) in San Francisco.

Scalable from 1 up to 4 pluggable Xilinx Virtex UltraScale XCVU440 based FPGA modules the Quad system offers a capacity of up to 120 million Asic gates.

Up to five Quad systems with overall 20 FPGA modules can be easily connected together to increase the capacity up to 600 million gates.

Pro Design also has a development system called Uno for IP or sub designs development and can reuse the FPGA modules for complete SoC and Asic prototyping by plugging the same proFPGA Virtex 7 or UltraScale FPGA modules on a Duo or Quad motherboard.

There are also motherboards, FPGA modules, daughter cards and accessories which can be used in combination with the proFPGA XCVU440 FPGA modules.

The system comes with the proFPGA Builder software, which provides an extensive set of features, like advanced clock management, integrated self- and performance test, automatic board detection and I/O voltage programming, system scan- and safety mechanism, and quick remote system configuration and monitoring through USB, Ethernet or PCIe, which simplifies the usage of the proFPGA system tremendously.

The systems are available for early adopter customers with general availability in Q4 2015.

 

 

 

 



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Beefed-up X-cap discharger

CapZero-2Power Integrations has announced a second generation of its novel CapZero discharger chip for mains X-capacitors.

X-capacitors can hold charge after mains-powered equipment is turned off. Without a discharge device, this can result in residual high-voltage being present, for example, on a disconnected mains plug.

The simplest discharger is a resistor, but using one results in constant power dissipation.

CapZero is a two terminal integrated circuit that remains in a high-impedance state (21.7uAmax at 25C = 5.2mW at 240V) when mains frequency is connected, then switches to a low impedance state when mains frequency is removed, rapidly discharging the capacitor. Discharge current is limited by a series resistance totalling 142k to 7.5Mohms.

CapZero-2 can handle a wider range of capacitors than the original – now from 0.1µF to 6µF – and voltages up to 1kV (6kV transient). The orignal CapZero was a range of products, with the same quiescent current, rated at either 825 or 1,000V, and up to 5µF.

Second generation products are safety-certified to CB and Nemko requirements, developers do not need to perform a separate capacitive discharge safety test of the power circuit.

“CAPZero-2 allows power supplies to comply with IEC 62368-1, the new over-arching safety standard covering a broad segment of energy-using equipment. The standard replaces IEC 60950 and IEC 60065, and will shortly become mandatory,” said the firm.

Packaging is SO-8.

Applications include air-conditioners, home appliances, small appliances, cookers, vacuum cleaners, TVs, desktop and notebook PCs, projectors, workstations, computer monitors, and printers.



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TSMC to triple 16nm chip capacity by end-2016, says co-CEO

TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early 2016, according to president and co-CEO CC Wei. Total production capacity of the foundry's 16nm FinFET processes at the end of 2016 will triple that a year earlier, said Wei.

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Foxconn to build supply chain financial service system

Foxconn Electronics plans to build up a financial service system for the industrial supply chain, offering loans and real time information to suppliers within the system, according to company chairman Terry Gou.

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Digitimes Research: Six 2-in-1 Chromebooks scheduled for 2015 to tackle non-education markets

In addition to Lenovo's N21 2-in-1 Chromebook launched in February and Asustek Computer's Chromebook Flip 2-in-1 device released in April, Google, Hewlett-Packard (HP) and Acer are also planning to unveil Chromebook products in the second half. With the devices, the market will see at least six branded 2-in-1 Chromebooks in 2015, showing that Google's aggressive moves to integrate Chromebook with Android are succeeding in promoting the devices in non-education markets.



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CSOT starts producing 55-inch Full HD TV panels at 2nd 8.5G factory

China-based TFT-LCD panel maker China Star Optoelectronics Technology (CSOT) in late April 2015 started operations at its second 8.5G factory in southern China and began production of 55-inch Full HD LCD TV panels at a yield rate of over 80% in early May. CSOT will later produce 55- and 49-inch Ultra HD TV panels, according to the company.

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HTC to block media from attending shareholders meeting

HTC has announced that it will not open its upcoming shareholders meeting, scheduled on June 2, to media, a measure which is not common for listed companies in Taiwan and may reflect recent lackluster sales performance, according to industry sources.

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GIS expects 2Q15 revenues to fall 15-20% sequentially

General Interface Solution (GIS), a touch module maker and touch panel BPI (back-end process integration) service provider belonging to the Foxconn Group, expects consolidated revenues for the second quarter of 2015 to decrease 15-20% on quarter mainly because some clients have deferred production, according to the company.

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Demand for overclocking surges in the face of declining desktop market, says HWinsights

Demand for enthusiast class PC hardware which offers high-performance, reliability, and above all gives the end-user the ability to tweak, fine-tune and tinker, has seen a rapid increase over the past few years. While the overall desktop market has reached stagnation and begun to decline, annual growth in the number of overclockers between the period first-quarter 2013 and first-quarter 2014 was around 50%, and growth between first-quarter 2014 and first-quarter 2015 increased even further at around 100%, according to data compiled in the latest HWinsights Quarterly Report.



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Taiwan market: Sony Mobile launches new flagship Xperia Z3+, Xperia Z4 Tablet

Sony Mobile Communications has launched its latest flagship smartphone the Xperia Z3+ in London, the UK and has also hosted a launch conference in Taiwan.

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sureCore offers FD-SOI SRAM core

sureCore, the Sheffield low power SRAM IP company, has announced commercial availability of its first, ultra-low power, embedded SRAM IP. The silicon proven, 28nm FDSOI production design targets applications demanding long battery life with minimal operating and stand-by power performance.

Supporting an operating voltage range of 0.7-1.2V, the Single Port SRAM boasts dynamic power savings exceeding 50% of current commercial offerings. The IP also cuts static power by up to 35% with only a modest 10% area penalty.

“As the semiconductor industry addresses many diverse leading-edge applications ranging from Wearables to IoT to Cloud Computing, and even Automotive, the key challenges to the creation of both innovative and commercially competitive products are going to be power consumption, heat dissipation and battery life. sureCore is dedicated to minimizing both dynamic and static power to help bring the promise of these technologies to fruition,” says Paul Wells, sureCore CEO.

sureCore’s 28nm, ultra-low power, FDSOI SRAM IP is the first product on a roadmap that includes the introduction of a 40nm, Bulk CMOS, Ultra Low-Power SRAM later this year. Work is also under way on a 28nm, Bulk CMOS solution.

“Because of migration costs, there is still considerable innovation happening at relatively mature production nodes,” says sureCore’s Chairman, Guillaume d’Eyssautier, “these nodes are predicted to have extended longevity and strategically we felt it important to provide groundbreaking solutions for these nodes so this is where we have focused our road map.”

Embedded memory has become increasingly prevalent in modern SoC designs to support multiple processors running numerous software applications. Historically, however, SRAM has proven extremely power hungry. sureCore’s ultra-low power SRAM dramatically cuts both dynamic and static power through its patented suite of advanced circuit design techniques.

sureCore’s SRAM IP technology is particularly attractive for developers of wearable electronics and Internet of Things (IoT) applications where extending battery life is crucial. The IP also provides considerable value in the networking space where power and heat dissipation are critical considerations.



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LPRS sponsors Warwick’s next CubeSat

LPRS WUSat

WUSat sits in its ejector, bolted to the nose of a sounding rocket

Low Power Radio Solutions (LPRS) is to join the sponsors of Warwickshire University satellite programme, whose second WUSat CubeSat recently impressed the European Space Agency by maintaining communication throughout re-entry after a ‘Rexus’ launch from Sweden.

“This was the first occasion that an ESA/Rexus launch device had successfully achieved stand-alone radio transmission on re-entry,” said LPRS.

WUSat’s radio transmission system was based on LPRS’ sub-GHz eRIC (easyRadio integrated controller) modules – donated for the Swedish shot by RS Components. It was through this donation that LPRS got to hear of the WUSat team and decided to help out with future missions.

The Warwick team consists largely of undergraduates, led by Dr William Crofts.

“LPRS is grateful to RS Components for introducing the WUSat team to eRIC and is very excited to have the opportunity to assist engineers of the future in discovering the potential of wireless technology,” said LPRS.

Click here to find more about on Electronics Weekly.



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Real-time management of cash-flow

It is an unfortunate truism that many start-ups fail because they don’t pay attention to the cash-flow.

Big organisations can reconcile their outflows and inflows daily, even hourly. Small companies couldn’t until New Zealand software company Xero came up with a package that connects a company’s accounts to its bank and to its payments system allowing the monitoring of cash-flow in real-time.

The Xero system has attracted investment from the legendary Peter Thiel, co-founder of Paypal with Elon Musk, and the model for the wildly eccentric billionaire Richard Gregory in the TV series Silicon Valley.

Total investment in the fast-growing Xero now tops NZ$230 million. Worldwide there are 475,000 users of Xero’s package.

Now Xero has linked with Swedish mobile payments start-up iZettle which enables small businesses to make and receive credit card payments via mobile devices.

IZettle gives away its card reader which plugs into your phone, tablet or laptop. It processed $2.3 billion worth of transactions last year.

The iZettle-Xero integration allows credit card transactions to be recorded instantly in the accounts of a business keeping it constantly on top of its cash-flow.

Xero is good at this kind of integration, recently hooking up with with Formitize, a company which provides and automatically populates forms for a vast number of business functions



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2015年5月27日 星期三

Avago, Broadcom Combo Praised

Reports Avago will bid to buy Broadcom amid an industry consolidation are getting praise from the stock market and semiconductor analysts.

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LCD monitor panel prices in May fall, says WitsView

Prices for 21.5- and 23.8-inch LCD monitor panels in May dropped US$1.0-1.50/panel and those for 19.5-, 23- and 27-inch models by US$0.8-1.0/panel, according to WitsView.

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Taiwan becomes major revenue contributor to Google

Taiwan has become an important market for Google, a top-five market in terms of revenue contribution from paid apps at Google Play, according to Google.

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Taiwan solar cell makers under pressure of upgrading technology

As China has become the largest PV producing country and PV market around the world, China-based PV makers have been bringing increasing competitive pressure on Taiwan-based makers and consequently Taiwan-based crystalline silicon solar cell makers have to upgrade technology to cope with the situation, according to industry sources in Taiwan.

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M31 teams up with Imagination

Silicon IP provider M31 Technology has announced a collaboration with Imagination Technologies. The companies will focus on low-power technologies for the IoT, wearables and other applications where embedded computation along with integrated wireless communications are required to be powered for extended periods of time on a small coin cell battery.

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TSMC to beat Samsung in 10nm race

TSMC is confident that the company will beat Samsung Electronics in ramping up production on its 10nm lines, according to the Taiwan-based foundry.

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Google BrandLab to set up branch office in Singapore in 2H16

BrandLab, a business unit of Google, plans to set up a branch office in Singapore in the second half of 2016 in order to meet increasing demand from brand operators in Japan and Southeast, according to Kim Larson, global director of BrandLab.

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Seagate names new head for Taiwan office

Seagate has appointed Huang Yuching as its new general manager for Taiwan operations and has assigned him to handle tasks such as sales and marketing.

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MediaTek to expand workforce in 2015

MediaTek will hire a total of 2,000 extra workers in 2015, according to the IC design house.



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UMC holds technology forum in Japan

United Microelectronics (UMC) on May 27 held its 2015 Japan Technology Forum to showcase the company's IoT and automotive IC manufacturing solutions to Japan-based semiconductor companies.

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Sharp to launch smartphones in Indonesia, says report

Sharp will launch smartphones in the Indonesia market in 2015, starting with the Aquos Crystal, a model launched in North America in October 2014 through cooperation with Sprint, according to Japan-based Nikkei News.

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Xray Sensor Startup Raises Funds

MultiX SA has developed a sensor the ME100 based on CdTe and CdZnTe crystal material. This together with a signal conditioning ASIC and high-speed front-end electronics is capable of measuring the energy of each incident x-ray photon.

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Single-Molecule Diode Technique Targets Made for Nanoscale

Researchers report they have created a single-molecule diode for nanoscale devices.

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Introducing the Cubic Board -- A Completely Open Source FPGA Project

One of the main design considerations for the FPGA-based Cubic Board was to make it easily accessible to both software and hardware developers.

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Gaming Helps Tool Emulate True Power Peaks

Mentor Graphics' Veloce Power Application software identifies power consumption problems in emulation, enabling them to be nixed before fabrication.

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Can You Trust a DR-Check Without a DR-Spec?

Designers may find the flow from the design rule specification tool to the design rule check tool to be surprising (spoiler: there is no design rule specification tool).

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Implanted Biosensor Can Be Wirelessly Charged

A laboratory at the Ecole Polytechnique Federale de Lausanne has developed an implantable biosensor that can report measurements wirelessly and powered by a battery worn on the skin.

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Sensor Choices Power Industrial Internet Innovation

Whether or not the Internet of Things will live up to its own hype, the notion has certainly got people thinking. Proposals range from the "Internet of Everything" to some more focused concepts such as the Industrial Internet; a term first introduced by electrical giant GE, and now understood to mean the automation of industrial environments using sensor networks and machine-to-machine communications.

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Altium's Free PCB Tool Available for Test and Evaluation

Looking to attract would-be electronic designers in the DIY maker, open hardware and hobbyist world, Altium has just released the beta version of its free community-driven CircuitMaker PCB tool.

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Achieving a 75GHz Test Socket

Sponsored by: Ironwood Electronics
For over half a century, the semiconductor industry has been governed by a commonly known principle described as Moore’s Law. This “law” predicts that through technological advancement a doubling of the number of transistors per integrated circuit will occur within a given geometric area on regular 18 month intervals.

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MIPS P5600 core licensed for Russian comms processor

MIPS Baikal TC-1Russian fables chip firm Baikal has integrated a multi-core MIPS Warrior P-class (P5600) CPU into its Baikal-T1 communications processor. 

“We are glad to present the world’s first publicly-announced implementation of the P5600 CPU,” said Baikal CTO Grigoriy Khrenov, “We created a high-performance, highly efficient communications SoC with a wide range of modern high-speed interfaces. Another valuable feature is the possibility to design passive cooling solutions.”

Applications including wireless routers and home gateways are foreseen – with products expected to be on the shelves at the end of this year.

P5600 is based on a wide issue, deeply out-of-order implementation of the MIPS32 architecture, supporting up to six cores in a single cluster with cache coherency. It has hardware virtualisation for security and and 128-bit SIMD support for data parallel operations and DSP. 

The SoC comes with a set of extensible software based on open source code.

Baikal-T1 engineering samples are available now.



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How to Order IC Sockets

Sponsored by: Ironwood Electronics
Many products are designed with today’s high-performance Integrated Circuits (IC). Without IC sockets, the design, testing, and/or production phases of a new product development process will be chaotic.

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Impact of PCB plating Finish on Elastomer Socket Technology

Sponsored by: Ironwood Electronics
Today’s electronic packages have high clock speeds (multi GHz range), fine pin densities (below 0.4 mm pitch) and high pin counts (over 2000). When these packages are assembled onto a printed circuit board (PCB), they perform certain functions at certain speed.

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Powdered iron SMD inductors saturate up to 5A

Vishay SMD inductor Vishay has introduced a series of 0806 and 1008 low-profile, high-current power inductors with powdered iron cores for saturation current up to 5.8A. 

‘IHHP’ devices are offered in 2.0 x 1.6mm (0806) or 2.5 x 2.0mm (1008), each 1.0mm or 1.2mm high.

“The devices released today are optimized for dc-dc converters and power supply modules in notebook PCs, mobile phones, hard disk drives and solid-state drives. Magnetic-alloy power inductors offer low acoustic noise and provide magnetic shielding to prevent interference with nearby components,” claimed the firm. 

Resistance is down to 15mΩ, and inductance is from 0.22 to 10µH.

Heat rating current is up to 5.3A and operation is from -55 to +125°C.

Production quantities are available now, with lead times of eight to 10 weeks for large orders.

Part number IHHP-0806AB-01 IHHP-0806AZ-01 IHHP-1008AB-01 IHHP-1008AZ-01
Case size 0806 0806 1008 1008
Profile (mm) 1.2 1.0 1.2 1.0
Inductance (µH) 0.22 to 2.2 0.22 to 2.2 0.47 to 10 0.24 to 4.7
Resistance typ. (mΩ) 13 to 133 15 to 132 20 to 390 12.5 to 240
Resistance max. (mΩ) 16 to 155 19 to 158 24 to 468 15 to 288
Heat rating current (A) 1.8 to 5.3 2.0 to 5.2 1.1 to 4.5 1.4 to 5.0
Saturation current (A) 1.9 to 5.8 2.1 to 5.2 1.2 to 4.8 1.4 to 4.9

 



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SoC From Russia With MIPS

Baikal Electronics of Russia, announced its T1, the first chip to use MIPS Warrior cores, will take on Broadcom and others in WiFi routers and home gateways.

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CES Asia: 'Zero Distance' to Supply Chains

Conspicuously missing from CES Asia are big name consumer electronics brands -- even local companies like Xiaomi and Lenovo. The show, however, signals the region's close proximity among product design, manufacturing and supply chains.

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Satisfy the Appetite for "Instant On"

Memory has emerged as a key differentiator in how embedded designers are achieving the user experience (UX) that today's consumers expect: instant on.

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IoT Security Groundswell Gathers

After plenty of talk, a wave of real action aimed at solving the Internet of Things's security problems is on the rise.

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On Control-S

That nervous twitch of the left hand to save files may be obsolete.

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Socionext samples video playback IC

Socionext, the Fujitdu-Panasonic SoC jv, is sampling a single-chip IC for 4K/p60, HEVC and VP9 playback with built-in HDMI-Tx/Rx. The is compatible with HEVC Main 10 profile, and supports new copyright protection, HDR and wide color gamut. 

As 4K resolution video becomes more popular and a wider variety of video content is available through the network, there is a high need for a playback capability for new video formats in addition to conventional full HD. HEVC, the new data compression technology is being adopted now for 4K Video, in particular. The market requires a compact, low-power chip that performs real-time decoding of HEVC-compressed 4K/p60 video, allowing output of high quality video with various image processing effects.

Socionext’s MN2WS03101A supports 4K/p60 video all the way through input, decoding to output. It can accommodate the high quality playback of 4K video such as HEVC, VP9 and H.264. It supports the up-conversion of Full HD videos with the conventional codec standards, such as H264 or MPEG-2, to 4K, using super-resolution processing.

The new device is also capable of real-time, multi-channel transcoding (Four-channel Full HD videos to H.264 or to MPEG2) and 4X speed transcoding of Full HD one-channel video, which is applicable for media distribution equipment such as recoding instruments or home gateways.

Socionext plans to start volume production of MN2WS03101A in the second half of 2015, targeting it for next generation 4K video equipment.

Socionext targets video applications. It is sampling a 4K HEVC real-time encoder MB86M31. Together with MN2WS03101A, the company will support a total video solution for a wide range of applications.

Other MN2WS03101A features include: HDMI 2.0 Input (HDCP2.2), high quality and high definition video processing (HDR, BT. 2020) and stress-free special processing such as image compositing, rotation, or deforming. It is available now in samples in FCBGA-1177 31mm x 31mm package.



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More on: University of Warwick CubeSat triumph

Harwin WuSat satelliteSomewhere in northern Sweden there is a small crater, and at the bottom of that crater are the remains of triumph of student engineering: WUSat2.

It was designed to free-fall from space at up to twice the speed of sound, gathering atmospheric data on its 100km journey, sending it live to an earth station because WUSat had almost no chance of survival.

The triumph was that the ground station got the data, all except the last little bit.

“The European Space Agency said this was the first time they had had a free-falling unit with communication that actually worked,” Warwick Satellite Programme director Dr Bill Crofts told Electronics Weekly. They didn’t get contact all the way down. We think the antenna may have burned up.”

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Crofts is director of the University of Warwick’s satellite programme, and WUSat2 is a stepping stone on the University’s plan to get a satellite in orbit.

The first step, if you discount six years of work on an ESA moon-orbiting space programme that got shelved in 2012 through no fault of Warwick’s, was WUSat1, dropped from 30km altitude (see photo) over England.

Its journey started slightly less glamorously than WUSat2′s rocket-assisted trajectory, on a weather balloon launched near Welshpool.

“This was the first test, for the systems and tracking,” said Crofts.

Both WUSat1 and WUSat2 were CubeSats, based on the 10x10x10cm 1kg format that has proved so popular amongst university space shots.

WUSat1 was mostly COTS (commercial, off the shelf) components, but for WUSat2 things had to get more serious.

The launch was on an ESA programme called Rexus (rocket experiments for university students) which is jointly run by the German and Swedish space agencies, from which Sweden makes some of its payload slots available to other European countries. Launches are from Esrange, north of Arctic Circle.

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To get on a flight, in this case on Rexus 17, Warwick’s team of undergraduates had to compete with 11 other teams to show that they had a viable mission. “It is quite rigorous programme, you have to show simulation and modelling,” said Crofts.

You also have to have a viable science experiment, which was thought up by Warwick physicist Professor Don Pollacco – more of this later.

Winning the launch slot was only the first hurdle. The team had to show their spacecraft could both survive the launch, and not ruin the launch for others.

“It’s a pretty rigorous process, going through ESA. They set pretty high standards and you get treated pretty as much as a commercial sub-contractor,” said Crofts.

Several commercial companies, including RS Components and Thales, helped nudge the students in the right direction.

One of them was Portsmouth-based connector maker Harwin.

The electronics in CubSats is generally distributed over several PCBs plugged together in a stack.

“Having high quality high-reliability connectors was pretty much part of the design,” said Crofts.

Ben Green of Harwin takes up the story.

“We have worked with Warwick for a number of years. They had been using our DataMate connectors – they used them for the balloon launch, but for the rocket launch we recommended the Gecko line. It’s got very small pitch [1.25mm], very good high vibration and high shock”, he said, adding that many people use Micro-D connectors in CubeSats, but “Gecko is much smaller and much lighter. The Surrey Space Centre is using them in its QB50 CubeSats as well.”

For vibration resistance, the Gecko female part has four-point contact through beryllium copper springs: “There is no discontinuity of current up to 20G vibration and 100G shock,” said Green.

Another thing that swung the choice was that the Gecko range has cable-to-board connectors alongside board-to-board types, and that pins are available pre-assembled with PTFE-insulated flying leads of 150, 300 or 450mm, in both 26 and 32AWG sizes.

The other specs are: -65 to +150°C, 250Vdc or 250Vac peak at altitude, 2A/pin on all pins (2.8A for a single pin), and finally a life of 1,000 disconnections. “I don’t think they got anywhere near that,” said Green.

Science

Pollacco’s scientific experiment, dubbed Solspec, measured the Sun’s spectrum at different atmospheric path lengths as an analogy to the study of exoplanet atmospheres. It gathered data on oxygen and sodium concentrations using photodiodes to analyse light through various optical filters – bought to the experiment through optical fibres from translucent domes on either side of WUSat2. Received data was “pretty much consistent” with known atmospheric data, said Crofts.

From post-flight analysis of Doppler shift of the radio signals, the researchers are also attempting to get a speed profile for the decent.

The optical domes protruded outside the traditional 1U CubeSat profile, precluding the use of a standard ‘P-POD’ CubeSat ejector, so the team built a custom spring-loaded ejector to separate WUSat from its attachment beneath the rocket’s nose cone.

Unlike its more glamourous companion, the ejector made it back in one piece, stuffed with snow but unharmed. It was still attached to the rocket, which is saved for re-use by its own recovery parachute.

Originally it was planned that WuSat2 would have its own parachute, but it became obvious there was not enough room – particularly as sophisticated parachutes are required to brake from high speed.

“There was no guarantee we would get WUSat back at all, which put a great onus on communication,” said Crofts.

As the spacecraft could only have a tiny aerial, link budget was improved by building two large custom helical antennas for the ground station – whose equipment was also created by the team.

And just in case the comms link still couldn’t make it, sensor data was backed-up on flash memory, which is probably safe in that hole in Sweden.

To avoid any chance of messing with the rocket’s systems, WUSat had fly totally un-powered, booting-up 15 seconds after the pyro-cutters had initiated separation.

Processing came from a PIC microcontroller, “selected by the 2013-14 team as they felt it represented the simplest and lowest power consuming control architecture”, said Crofts.

Power and comms for charging and checking the CubeSat whilst installed in the ejector were are available through an umbilical that disconnected on ejection.

Parts including the domes, battery casing, and some of the flat-packed antenna were 3d-printed, and much of the rest was machined from aluminium.

Everything was designed and made at Warwick for the satellite and ejector, and most of the testing was done inside the university – which has its own vibration facility, said Crofts.

He is proud of his student-led satellite team, which each year comes from the fourth year Warwick’s MEng course. “Nine years in existence and eight years on ESA projects. That’s quite something for undergraduates,” said Crofts.

Already WUSat3 is in the pipeline. With the credibility it has built up, the university is looking for a low earth orbital launch this time, and there is even a possibility it will be from the International Space Station.



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PCIM: First trench SiC mosfet is 2x better

Rohm SiC trench mosfetTrench structures will halve the on-resistance of silicon carbide power mosfets, claimed Rohm.

“Compared to existing planar-type SiC mosfets, on-resistance is reduced by 50% in the same chip size, making it possible to significantly decrease power loss,” said the firm. “Switching performance is improved with approximately 35% lower input capacitance.

In a trench structure, the mosfet gate is formed on the sidewall of a trench in the chip surface.

“Unlike planar-type mosfets, JFET resistance does not exist, making greater miniaturisation possible. This is expected to result in on-resistance close to the performance of the original SiC material,” said Rohm.

For long-term reliability, the new structure mitigates the electric field generated in the trench gate – see diagram.

Combining the SiC trench mosfets with SiC Schottky diodes in a 1200V/180A half-bridge module, 42% reduced switching losses are claimed compares with planar SiC mosfets.

 



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Hybrid connectors address challenges of PoE

 HartingHybrid interfaces have been used in IT for a long time. Everyone is familiar with the USB and power over Ethernet (PoE) interface standards, through which end devices are supplied with both data and energy. These developments are also in demand in the more general industrial environment.

Data transmission rates are increasing and industry standard interfaces such as RJ45 and M12 connectors now cater for data transmission rates from 100Mbit/s up to 10Gbit/s, but transmitting data, signals and power at the same time places new demands on the cabling structures used to date.

This challenge is addressed by IP65/67-rated hybrid connectors which combine multiple Ethernet contacts in Cat.6A (RJ45) configuration and power contacts up to 5A.

Smart interfaces

As industrial Ethernet becomes better established, more and more applications will require special configurations. The simultaneous transmission of data and power via a single cable and one connector will therefore become increasingly attractive. This will enable the connectors themselves to become smarter by incorporating diagnostic and monitoring functions.

Industry bodies are currently working together to establish standards for the connection of different machines, systems and components under the Integrated Industry concept, but the emergence of smart power boxes which offer connection options for Ethernet in combination with a power supply gives one indication of the way things are developing.

In the field, this approach allows much simpler and less costly wiring for systems compared to the terminal boxes that are otherwise necessary. Data can be retrieved from field devices via software within the box or by the industry standard OPC-UA framework, while the components can be supplied with electricity at the same time. The software can also be used to monitor power consumption, simplifying maintenance and diagnosis.

Power over Ethernet

Power over Ethernet (PoE) has been used in IT up to now to connect Ethernet devices such as hard drives and WLAN adapters to one another. The relevant IEEE standard 802.3af-2003 for the parallel transmission of energy and data via twisted-pair cables has been established for some years.

The original IEEE 802.3af-2003 PoE standard provides up to 15.4W of DC power to each device.

With the PoE+ standard (IEEE802.3at) the transmit power is increased to 25.5W and potential y even higher.

Modularity, scalability and flexibility have always been required in industrial production systems, but Integrated Industry – with its decentralised, distributed intelligence and modular, self-organising systems makes these requirements even more critical. This, however, is an evolutionary process for automation and mechanical engineering companies, since current machinery must function within the existing environment while simultaneously being capable of migrating to Integrated Industry.

Machinery and modules with adaptive program code and flexible interfaces are evolving from earlier manufacturing systems with non-changeable process sequences and rigid structures.

Interfaces have been tasked with a key role in this evolution towards adaptive, highly flexible production systems: not just communication interfaces but interfaces between all machine elements and at all levels of the production process.

In connector terms, this has involved the introduction of scalable, pluggable interface solutions for power, control, signal and data connections.

Industrial integration

The functionality of these interfaces has been expanded to meet the special requirements of, and the migration to, Integrated Industry. For example, the connector interfaces can be integrated with RFID systems to enable the identification of all elements involved in the production process, which includes work pieces, tools and machine modules, in addition to allowing flexible data storage directly on the elements or with reference to the element.

In addition, data storage directly in the industrial connector is also an option with modules, which are mechanically constructed so that they can be assembled into modular connectors directly alongside other power, data and signal modules.

On the control side, these modules communicate directly with machine controllers, such as PLCs and industrial PCs, via industrial bus systems or discrete I/O.

These features will allow for migration to hybrid interfaces which will be important elements in flexible manufacturing systems of the future.

Writer is Kevin Canham, product and applications manager at Harting

 



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Five reasons why EMC testing should start early

bytesnapEMCYou have built a great product that meets market demands. You are confident that it radiates little energy and is not susceptible to outside interference, yet when you reach final EMC testing stage, your product fails.

This is the nightmare scenario for most of us product designers. The cost of testing was already high, but re-testing will stretch the planned budget and slow down the entire project.

The misplaced confidence that has led to a failed compliance test means that design engineers need to find out why the product failed and how to fix it.

To avoid this scenario, pre-compliance testing should not be considered as an add-on to the end of a project. Instead compliance testing should be built into a project from day one.

In the software testing industry, there is a move to shift testing left and introduce it earlier in the product development lifecycle.

Likewise, this thinking is moving to the electronics industry – investigating emissions from your device during each major development stage is the best way to avoid costly re-testing and high failure rates.

There are a number of advantages of pre-compliance testing:

 

1. Early error detection speeds up project lifecycle

The earlier product deficiencies are identified in the development process, the easier it is to rectify any shortcomings. Fixing problems after compliance testing is much more expensive and time consuming than fixing them during the design stage.

Pre-compliance testing can focus on the areas that you have identified as potential causes for concern and find solutions for them early.

The risk to a design failing is usually relative to how long you delay testing, so designers that leave testing to the project end are completely reliant on the design team’s skill and experience.

An analogy I like to use is the process of baking a cake without checking the taste at different phases of the process, but instead of making and baking the cake and then finding out you forgot to add enough sugar.

Early analysis of the electronics can also drive system decisions. EMC is not just about electronics, it’s about the system and mechanical changes may be required, such as adding EMI shields, coating boxes or adding EMC foam to fill any leaks/gaps in an enclosure.

 

2. Testing is already done to compliance standards

Using an anechoic testing chamber before formal testing can determine whether a design will meet relevant compliance standards. The ability to test to EN55022, EN61000 and EN61000-3-2, as well as MIL-STD-461 for emissions provides confidence in your design.

Setting pre-compliance as a milestone can help keep a project healthy by focusing the team on ensuring that the software, electronics and mechanics will be in at a certain standard for the test. This could be for example testing the front end of a data acquisition system, or the processor module on its own in a mechanical enclosure that runs data processing algorithms.

 

3. More agile projects where testing is integrated in development

Stand-alone pre-compliance testing can be expensive especially if a product doesn’t pass first time, as subsequent rounds of testing will be required after design alterations. However, when testing is integrated into development, a testing chamber and expert advice is available during the entire project lifecycle.

Design engineers that offer EMC pre-compliance testing as part of their services will be continuously on the lookout for areas of risk during product development. For instance, testing during development with evaluation or strip boards will provide the designer with the opportunity to add in preventative measures in the form of additional circuitry, such as signal bead filters, to prevent potential issues.

 

4. Reduced risk of failing certification

Early EMC testing can de-risk a project by determining non-compliance issues prior to submitting for formal testing. As well as EMC, a chamber can be used to measure comparative signal strength for low power radios to check performance over time, or the effect of modifications. Pre-compliance testing makes certification an overall less stressful experience.

 

5. Changes are made based on real world feedback

Early EMC testing can save money by reducing over-engineering, so ensuring that a product can pass compliance tests easily. Before a product is tested it is not known where the problems might occur.

This can lead to counter-measures being added where they are not required.

As an analogy, Henry Ford used to send engineers to examine Ford cars in scrap yards to understand which components still had lots of life in them due to over-engineering. This helped his engineers to downgrade the specification on these components to achieve a cost saving.

The equivalent can be done with EMC testing to optimise the bill of material cost.

Writer is Dunstan Power from ByteSnap Design  

 

 

 



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