2014年8月25日 星期一

Intel Shrinks 3G Chip for IoT

Intel's latest modem for the mobile Internet of Things, the XMM 6225, aims to grow into the market with cellular communications and high levels of integration. The company is touting the platform as the industry's smallest, with a 300 mm2 footprint.



from EETimes: http://ift.tt/1qkpXrI

via Yuichun

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