In an event that provided a broad overview of its plans, TSMC described a family of 2.5- and 3-D chip stacks that could help kick start the technology.
from EETimes: http://ift.tt/1jGejAA
via Yuichun
from EETimes: http://ift.tt/1jGejAA
via Yuichun
沒有留言:
張貼留言