Lextar to debut white chip LED featuring substrate-free flip chip and phosphor molding process

Lextar Electronics will debut a package-free "white chip" LED technology that features substrate-free flip chip and phosphor molding process, and can be fabricated by current SMT equipment. The white chip is a chip scale die without packaging process, featuring high lumen densities, high lumen output, wide beam angle, and can be packaged closer therefore simplify optical lens design. Lextar's white chip can be applied to lighting products especially small-size lamps such as spot or candle lamps. It can also be applied to backlighting, helping reduce the thickness of direct-lit backlight modules, according to the company.



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via Yuichun