Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%

Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness of their existing 0.6mm heat pipes for smart mobile devices by 25% and the new heat pipe is expected to enjoy a penetration rate of over 15% in the smart mobile device market with orders from tablets and smartphones, according to sources from the upstream supply chain.



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via Yuichun