Altera-TSMC tie-up to bring advanced packaging technology to Arria 10 FPGAs and SoCs

Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's 20nm Arria 10 FPGA and SoC solutions, according to the two companies.



from DIGITIMES: IT news from Asia http://ift.tt/1jKdqrN

via Yuichun