EEVblog #1184 – Ebay $200 6.5 Digit Meter Search

EEVblog #1183 – RIFA Madness (Schaffner Repair)

EEVblog #1182 – Mains Interference Simulator Teardown

EEVblog #1181 – Car ECO OBD2 Fuel Saver SCAM!

Imec on Future Networks

This is the eighth in a series of essays by Imec about the future of electronics technology. This one is called Future Networks and is by Michael Peeters, director of Imec’s connectivity programme. Will people and their habitats become an integral part of tomorrow’s communication networks? The world has changed at breakneck speed in the ...

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Renesas MCU has hardware virtualisation function

Renesas claims to have the first MCU with embedded flash that integrates a hardware-based virtualization-assisted function while maintaining the performance of the RH850 products. This hardware-based virtualization assist technology can support up to ASIL D level of functional safety, providing greater levels of system integration. The RH850/U2A MCU is the first member of Renesas’ cross-domain ...

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Murata, Cypress and NXP team on wireless connectivity

Murata is collaborating with Cypress and NXP  to provide IoT developers with mix-and-match wireless connectivity and processing solutions. The combined products pair Murata’s wireless modules, based on Cypress’  Wi-Fi and Bluetooth combos, with a range of  processors from the NXP i.MX series. The solutions build upon Murata’s long-standing relationship with Cypress and NXP. Murata says ...

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Former Plessey head takes on Cambridge sensor spin-out as CEO

University of Cambridge spin-out Sorex Sensors has appointed Michael LeGoff as CEO – LeGoff founded LED-maker Plessey Semiconductors, and before that Dynex. Sorex raised £1.2 million seed funding last year from Cambridge Enterprise, the Cambridge Angels and Cambridge Capital Group. “The team has done a fantastic job in bringing its sensing technology close to the ...

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Embedded World: Bluetooth chip gets Arm Cortex-M33 to run applications and algorithms

Dialog Semiconductor has included an Arm Cortex-M33 application and algorithm processor in a Bluetooth 5.1 wireless microcontroller, to create a family called DA1469x. “The product family is the first wireless microcontroller in production with a dedicated application processor based on the ARM Cortex-M33 processor,” said Dialog. “The M33 offers developers greater processing power for more ...

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Embedded World: SamacSys announces a new Altium integration

SamacSys, the specialist provider of electronic component CAD models, has completed a new integration with Altium, the supplier of PCB design tools. The agreement was announced at Embedded World in Nuremberg and the collaboration will support Altium customers by directly integrating the SamacSys platform of free design resources, including PCB footprints, schematic symbols and 3D ...

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Embedded World: Trinamic chooses Risc-V for intelligent motor driver chip

German chip firm Trinamic has chosen Risc-V over Arm for the processor inside its latest generation of motor drivers – it specialises in drivers with advanced features, aimed at high-performance positioning systems like servos and those in computer controlled machines. Dubbed Rocinante (named from both Don Quixote and The Expanse, according to the firm), it ...

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Toshiba launches 31 single-supply single gate logic ICs

Toshiba has announced a range of single-supply single-gate logic devices. In total the line-up consists of 31 devices that simplify the design of voltage-level translation as used in data communication between devices, such as between microprocessors and peripherals. These single-gate devices are provided in tiny packaging that ensure that voltage translation can be implemented even ...

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Embedded World: TI launches BAW ICs

TI has announced  bulk acoustic wave (BAW)-based embedded processing and analogue chips for connectivity and communications infrastructure. The first two devices developed with TI BAW technology are the SimpleLinkTM CC2652RB wireless microcontroller (MCU) and the LMK05318 network synchronizer clock. BAW resonator technology integrates reference clocking resonators which improves performance and increases resistance to mechanical stresses, ...

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Imec on Augmented Reality

This is the seventh in a series of essays from Imec on the future of electronics technology. It is called Augmented Reality and it is by Imec principal scientist Soeren Steudel AR glasses have the potential to replace the smartphone within 10-15 years from now, says Soeren Steudel, who heads up the displays research activity at Imec. ...

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Call for cyber security innovators

The London Office for Rapid Cybersecurity Advancement (LORCA) today launches the open call for its third group of cyber innovators. The new group will be tasked with solving some of the most pressing cybersecurity issues, as identified by industry leaders at LORCA’s Innovation Forum. Details of the application process and a full description of the challenges can be ...

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Micron launches SSD using 96 layer 3D NAND

Micron’s  1300 SATA SSD uses 96-layer TLC 3D NAND-based SSDs and delivers storage capacities up to 1TB (in M.2) and 2TB (in 2.5-inch).  It delivers sequential reads/writes up to 530MB/520MB per second and random reads/writes up to 90,000/87,000 input/output operations per second (IOPS). It uses 75 mW. Itbsupports Microsoft Windows 10 Modern Standby requirements including adaptive thermal management ...

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Put up the evidence on Huawei, Vodafone boss tells US

The US should put up any evidence they may have that Huawei switchgear has been used for spying, says Vodafone boss Nick Read (pictured), The US has been pressuring countries and companies not to use Huawei gesr. However, says Read, not to use it involves a  “massive swap of equipment hugely disruptive to national infrastructure ...

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Embedded World: The Ultimate Arduino Challenge

The Ultimate Arduino Challenge was announced at Embedded World by Arduino co-founder Massimo Banzi. The Ultimate Arduino Challenge is divided into three categories: Data Collection, Industrial IoT, and Anything Goes. The Data Collection category tasks engineers with collecting data using an Arduino board and various sensors; The Industrial IoT contest tests engineers’ skills in designing ...

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Samsung ramps 512GB flash module; launching 1TB in H2

Samsung is ramping up production of its 512GB eUFS 3.0 3D NAND flash memory module. In H2 it plans to launch a 1TB device. Samsung’s 512GB eUFS 3.0 stacks eight of the company’s fifth-generation 512Gb 3D NAND die and integrates a high-performance controller. At 2,100 MB/s,  the new eUFS doubles the sequential read rate of Samsung’s ...

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Embedded World: Qualcomm and Geely look to 5G-enabled C-V2X

China car manufacturer Geely, Qualcomm and IoT specialist Gosuncn have teamed upto0put  5G-linked cars on the road in China in 2021. proposed its four steps G-Pilot strategy for autonomous driving in 2018. Presently, its autonomous driving is at Level 2 and will now provide Level 3 services with 5G and C-V2X technologies in 2021 for ...

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Hua Hong heads for 5nm

Hua Hong Semiconductor, the China foundry,  is looking to acquire a 14nm process next year. It also  plans to develop 7nm and 5nm processes. Hua Hong says it will add capacity to its fabs in Shanghai (Jinqiao, Zhengjiang and Kangqiao) and Wuxi, to achieve 350,000 wpm capacity next year.. Hua Hong’s first 12-inch fab dubbed ...

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Embedded World: Video Interview – SensiEDGE on lowering Barriers for IoT

At Embedded World 2019, we caught up with Milan Yudkovich, founder of IoT specialist SensiEDGE, as part of our promotional coverage for the event. He discusses how the company’s devices make it easier and faster for developers and startups to design their IoT applications. Thank you to Milan for his time. Read all our Embedded ...

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Embedded World 2019 – Video preview

Clive Couldwell, group editor of Electronics Weekly, anticipates attending Embedded World 2019, running 26-28 February, in Nuremberg. He expects automotive, AI and IoT security to be big themes of the show. And, if you are attending in Germany, he cordially invites you to come and say hello at the stand we share with OEMSecrets, who ...

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Embedded World: Video Interview – Analog Devices, on power management and embedded AI

At Embedded World 2019, we caught up with Jackie Rutter of Analog Devices, as part of our promotional coverage for the event. She discusses power control and power management, embedded AI, cyber security at the device level, and a wireless smart sensor system for condition-based applications. Thank you to Jackie for her time. Read all ...

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Embedded World: Video Interview – Lattice enables low-power AI at the Edge

We caught up with Hussein Osman of Lattice Semiconductor to discusses implementing AI at the network edge.

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Intel cans 5G deal with Tsinghua Unigroup

Intel has ended its year-old joint development deal with the Tsinghua Unigroup-owned chip manufacturer aunidoc to develop 5G modem chips, reports Bloomberg. Intel says the partnership has not been ended because of pressure from the US government, “We decided mutually that we would not continue the partnership,” said Robert Topol, GM of Intel’s 5G strategy and ...

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Embedded World: e-peas addresses thermal energy harvesting

e-peas, the Belgian low-power specialist, is applying its technology to energy harvesting with a chip optimized for energy harvesting from thermal sources in wireless sensors application. Supplied in a 28-pin QFN package, the AEM20940 is capable of extracting available input current up to levels of 110mA. Taking DC power from a connected thermal electric generator ...

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Embedded World: Insight SiP adds LoRa

At Embedded World today, Insight SiP, the specialist in ultra-miniature RF modules, is launching the ISP4520 series of modules, extending its product portfolio to include Long Range Networking via LoRa technology. The ISP4520 module integrates BLE and LoRa radio functionality to offer a unique solution, combining the short-range high throughput capability and easy smartphone/PC access ...

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Embedded World: UltraSoC demoes new IDE.

Today, at Embedded World in Nuremberg, UltraSOC announced that its UltraDevelop 2 IDE is now available for beta testing and is being shipped to qualified lead customers. The new IDE will be publicly demonstrated for the first time at Embedded World. Launched in October 2018, UltraDevelop 2 presents a complete and comprehensive IDE for system-on-chip ...

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Imec on Smart Industries

This is the sixth in a series of essays by Imec on the future of electronics technology. This one is called: Smart Industries. Man and machine collaborating on the factory floor: a nightmare or a match made in heaven? What will our factories look like in 2035? asks Pieter Simoens of the University of Ghent, ...

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DRAM takes a tumble

Q4 DRAM revenues fell by 18.3% QoQ, reports DRAMeXchange. ASPs of mainstream 8GB modules have fallen to $50 for January, and will continue to fall through in February and March, says DRAMeXchange, with an estimated decline of 20-25% for Q1. The production bit levels of DRAM suppliers in 4Q18 were far above sales bit levels, ...

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Infineon to sample e-SIM

Infineon will sample an eSIM  for mobile consumer devices in the middle of the year. It will be a tested and certified end-to-end solution comprising a chip, operating software and services. To facilitate technical integration of the eSIM into consumer devices and accelerate time to market, Infineon can also provide data plans in cooperation with ...

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Third month running of chip manufacturing equipment sales decline

January billings for semiconductor manufacturing equipment fell 10.5% compared to December’s billings, reports SEMI. As well as being down on December’s billings total if $2.1 billion, the January billings of $1.89 billion were also 20.8% down on the January 2018 billings figure of $2.37 billion. The January decline was the third consecutive month of decline. ...

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Embedded World 2019: Get the full Electronics Weekly Guide

A roundup of all the latest electronics news from Embedded World 2019 in Nuremberg.

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Last chance: Nominate BrightSparks before 28 February

Note the deadline for entries to EW BrightSparks 2019 - Thursday 28 February 2019. Please nominate a deserving colleague or friend.

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Sponsored Content: Siglent SDS5000X oscilloscopes tackle challenges of embedded circuit design

Sponsored Content: Siglent Technologies has recently presented their new flagship oscilloscope. It was shown the first time to the audience, end of January 2019, at DesignCon in America. The newly introduced Oscilloscope series SDS5000X is available with a bandwidth up-to 1 GHz, a maximum sample rate of 5 GS/s, and a maximum acquisition memory of 250 ...

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Arm introduces fourth security element to PSA

In October 2017, Arm introduced Platform Security Architecture (PSA), a set of hardware, firmware specifications, analysis models an open source firmware reference implementation for a scalable, secure IoT framework. The three initial pillars of analysis (threat and security analysis), architecture specifications for firmware and hardware and an open source implementation, are now joined by a ...

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GCHQ Director calls for international cyber pact

Ultimately cyber-security will only come from international agreement on a system of ethics and standards for operating in cyber-space, said the director of GCHQ, Jeremy Fleming (pictured) in a speech in Singapore today. “Our future security will be guaranteed not by the quality of our coding, the design of our silicon or the cunning of ...

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Huawei out-folds Samsung

Huawei’s answer to Samsung’s folding phone is bigger and thinner. The Huawei Mate X has an unfolded 8” screen, a 4,500mAh battery and is 11mm thick when folded compared to 17mm for the Samsung Fold. It’s also more expensive – $2,300 for the Mate compared to $2,000 for the Fold – more than double the ...

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Mark Bohr to leave Intel

Mark Bohr (pictured) Intel’s process guru, is to retire in March, reports The Oregonian. Bohr has worked at Intel for 40 years, latterly heading the group responsible for process migrations. Notable achievements were the introduction of high-k metal gate and finfets. However Bohr slipped up on 10nm which is running almost three years late. “We ...

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Q4 smartphone sales flat; iPhone sales down 11.8%

Q4 2018 sales of smartphones were flat with Q4 2017 at 408.4 million units, says Gartner. Apple sales fell 11.8% – its worst quarterly decline since Q1 2016. Table 1 Worldwide Smartphone Sales to End Users by Vendor in 4Q18 (Thousands of Units) Vendor 4Q18 Units 4Q18 Market Share (%) 4Q17 Units 4Q17 Market Share ...

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Embedded power ICs for automotive applications

Next month Infineon will sample a new family of Embedded Power ICs. The TLE985x series provides AEC Q-100 qualified H-bridge driver motor control solutions for 2-phase DC and single-phase brushless DC motors. It will support automotive customers in replacing relays in low-end motor control applications such as sunroof and window lift. By switching from relays to ...

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Image sensor for selfies and multi-camera configurations

Omnivision is sampling  a 1.12 micron, 8 megapixel (MP) image sensor family, designed for the broad smartphone camera markets. The sensor, designated OV08B, supports mainstream selfie imaging, as well as multi-camera configurations. “The 1/4 inch 8 MP sensor category continues to see tremendous volume opportunities in the mainstream mobile phone camera market. In addition to ...

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Industrial MPUs with 10 year Linux support

Renesas has introduced the RZ/G2 Group of 64-bit Arm Cortex-A57 and Cortex-A53-based microprocessors (MPUs) for industrial automation and building automation applications. The four new RZ/G2 MPUs are supported by the Renesas RZ/G Linux Platform for industrial applications, bringing increased performance, reliability, security, and long-term software support to mission-critical applications as well as standard applications with ...

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96Boards supports STM’s Cortex-A7 + Cortex-M4 STM32MP1

Arrow has introduced a develoment board for ST Microelectronics’ new Linux-enabled MCU that combines a 209MHz Arm Cortex-M4 core for real-time processing with dual 650MHz Cortex-A7 cores for the open-source operating system to run a human-machine interface. Called Avenger96 Development Platform and System on Module (SoM), the parts are intended to work within the 96Boards ...

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Variable drives for industrial automation

RS Components has introduced a range of industrial frequency converters for automation applications. Made by Rexroth, EFC 5610 is a range of intelligent variable-frequency drives, for use up to 7.5kW in the variants stocked by RS. They It offers vector control and a torque curve with high starting torque. Features include expansion options via I/O ...

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Infineon, Xilinx and Xylon develop logiHSSL core

Infineon , Xilinx and Xylon have developed the Xylon IP core called logiHSSL to enable high-speed communication between Infineon’s AURIX TC2xx and TC3xx MCUsand Xilinx’ SoC, MPSoC and FPGA devices via the Infineon High Speed Serial Link (HSSL). This serial link supports baudrates of up to 320 Mbaud at a net payload data-rate of up to 84%. ...

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GreenWaves raises $7m Series A

GreenWaves Technologies of Grenoble, a fabless semiconductor start-up designing ultra-low-power AI embedded processors for battery-operated edge devices, has raised €7 million in its Series A. The round was co-led by Huami, with the participation of Soitec, its seed round lead investor, and other investors. “This support from a distinguished group of corporate investors demonstrates the GAP ...

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Huawei’s charm offensive

Huawei is increasing its employee headcount in Canada and intends to have a plan to address UK security concerns about its switchgear by the end of Q2. Ryan Ding, head of Huawei’s carrier business group, says a “global and comprehensive” plan will be approved internally by the end of March. “In Q2 we will talk ...

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Logic processes advance on multiple fronts

Progress in the IC industry hinges on the ability of IC manufacturers to continue offering more performance and functionality for the money. As mainstream CMOS processes reach their theoretical, practical, and economic limits, lowering the cost of ICs (on a per-function or per-performance basis) is more critical and challenging than ever. The 500-page, 2019 edition ...

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NAND Heads South

Q4 NAND revenues fell 16.8% QoQ, reports DRAMeXchange,  2018 NAND revenues were 10.9% up on 2017 at $63.2 billion. A gloomy Q1 forecast sees declining bit shipments, price and demand The reasons are: economic uncertainty which has led to cancelled orders and delayed re-stocking, lower iPhone sales and the x86 CPU shortage. Samsung’s bit shipments for ...

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UltraSoC supports RISC-V SweRV Core

UltraSoC, the Cambridge embedded IP analytics specialist, will  support Western Digital’s RISC-V SweRV Core and associated OmniXtend cache-coherent interconnect. The two companies have worked together to create a debug and on-chip analytics ecosystem that will support the requirements of both Western Digital’s internal development teams, and third parties choosing to adopt the SweRV Core for their ...

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Gemalto claims to make first 5G SIM card

Gemalto says it’s produced the first 5G SIM. Compliant with the latest ETSI 3GPP specifications and SIMalliance recommendations, the Gemalto 5G SIM Claims to deliver improved data privacy,  seamless 5G global roaming and enhanced protection against hacking. The Gemalto 5G SIM will be available in all SIM form factors (removable SIM, M2M SIM, eSIM), during the ...

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Synopsis and GloFo team on auto 22nm FD-SOI

Synopsys and GLOBALFOUNDRIES are to develop a portfolio of automotive Grade 1 temperature (-40C to +150C junction) DesignWare Foundation, Analog, and Interface IP for the GF 22-nm FD-SOI(22FDX) process. By providing IP that is designed for high temperature operation on 22FDX, Synopsys enables designers to reduce their design effort and accelerate AEC-Q100 qualification of system-on-chips ...

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TI expands PHY transceiver range

TI has brought out two new Ethernet PHY transceivers, expanding connectivity options for designers of both space-constrained applications and time-sensitive networks (TSNs). The DP83825I low-power 10-/100-Mbps Ethernet PHY has a provides a 150m cable reach. The DP83869HM supports copper and fiber media, and offers high-temperature operation up to 125°C, which enables engineers to leverage the ...

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Hynix to invest $107bn in fab

Hynix says it will spend $107 billion building four fabs starting in 2022.. Hynix sees the investment as being necessary to ward off the threat of China which is building memory fabs. The fabs will be built on an existing 4.5 million square metre fab site with two front end facilities south of Seoul. Hynix ...

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Element 14 Community Awards

The winners of the element14 2018 Community Awards are: Member of the Year – Dixon Selvan – Selvan is a first-time Community Awards winner. He competed in the Design for a Cause challenge, submitted several RoadTest reviews, and contributed multiple projects to the monthly Project14 competitions. Selvan is a frequent contributor and integral member of ...

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Xilinx extends Zynq to sub-6GHz spectrum

Xilinx has extended ihe RF performance of its Zynq UltraScale+ RF SoC portfolio with devices which can cover the entire sub-6GHz spectrum. They support direct RF sampling of up to 5 giga-samples per-second (GS/S) 14-bit analog-to-digital converters (ADCs) and 10 GS/S 14-bit digital-to-analog converters (DACs), both up to 6 GHz of analog bandwidth. Xilinx’s RFSoC portfolio is ...

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Folding Phone

Samsung has unveiled its folding phone – the Galaxy Fold:                       The Fold costs $2000 and is on sale in Europe on May 3rd. It supports 5G. Folded, the Fold’s OLED screen measures 4.6”. Unfolded it measures 7.3”. Its processor is made on a 7nm ...

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Renesas adds MCUs to Synergy series

Renesas has added to its Synergy S5 MCU series with the entry-level S5D3 MCU Group. The four new S5D3 MCUs join the mid-range S5D5 and high-end S5D9 MCU Groups with similar S5 Series features—integrated 120 MHz Arm Cortex-M4 core and advanced security—as well as general-purpose features that simplify designing cost sensitive, low power IoT endpoint ...

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Qualcomm to sample RF front end devices

In H1, Qualcomm expects sample a number of RF front end devices: The QTM525 5G mmWave antenna module is for 5G smartphone designs thinner than 8mm. The module adds support for band n258 (24.25 – 27.5 GHz) for North America, Europe and Australia on top of bands n257 (26.5 – 29.5 GHz), n260 (37 – 40 ...

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AVX adds to wire-to-wire connectors

AVX has expanded upon its proven-reliable wire-to-wire (WTW) connectors with the 9286-300 Series poke-home connectors for 12–18AWG wire. Designed to simplify the connection process in a broad range of industrial market applications that require high-current or large-gauge wires, the 9286-300 Series WTW connectors enable simple strip-and-poke-home wire insertion and twist-and-pull wire extraction, and employ a one-piece ...

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ST Cortex-A7 chip makes it easy for MCU designers to adopt Linux

STMicroelectronics has boosted its STM23 family, adding dual 650MHz Arm Cortex-A7 cores to the existing Cortex-M4 (209MHz) to provide an upgrade path designers wishing to add Linux capability to STM32-based real-time control. The chip, called STM32MP1, gets its own open-source Linux distribution – OpenSTLinux – which contains Linux BSP, kernel, drivers, boot chain, and secure OS ...

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7nm chip integrates 2G-5G modems with 7Gbps download speed

Qualcomm is sampling a second-generation 5G New Radio (NR) modem designated Snapdragon X55. It is built on TSMC’s 7nm process with 2G-5G modems integrated on a single chip. It is expected to be in commercial mobile devices this year. It supports 5G NR mmWave and sub-6 GHz spectrum bands with up to 7Gbps download speeds ...

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AI start-ups huddle

AI start-ups Crossbar, Gyrfalcon Technology, Neural Networks Corporation andRobosensing are getting together to deliver an AI platform and standard for edge computing, gateways, cloud and data centers. The group, called SCAiLE (SCalable AI for Learning at the Edge), is already working with Japanese authorities to review opportunities for the 2020 Olympics, including video-based event detection ...

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Soitec and Shanghai Simgui up SOI wafer output

hSoitec and Shanghai Simgui Technology are to increase the annual production capacity of 200mm SOI wafers from 180,000 to 360,000 at Simgui’s manufacturing facility in Shanghai, China. Since signing their original licensing and technology transfer agreement in May 2014,  Simgui has installed  Soitec’s Smart Cut(TM) proprietary process to deliver  RF-SOI and Power-SOI wafers. Simgui’s strategic partnership ...

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Achronix unveils partner programme

Achronix has launched  its partner programme for EDA tools, software, and IP vendors with solutions and services directly applicable to Achronix’s Speedster FPGAs, Speedchip chiplet technology, and Speedcore eFPGA custom IP-block technology. This programme connects Achronix’s partners with the company’s rapidly growing customer base and provides partners with better access to developers who are creating ...

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Radar transceiver for presence detection in smart buildings

Imec has developed an 8GHz UWB radar transceiver for presence detection in smart building solutions. The power consumption of the radar is below 1mW,  and it is capable of detecting even micro-movements from human respiration, up to a distance of 15 metres. This performance delivers low-cost battery-powered way of detecting and counting people  in offices, ...

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ISSCC: Transceivers for radar and communication

RF tranceivers for radar and communication were the subject of Session 9 at the ISSCC (see below) this year, with 79GHz devices and on-chip bean-forming featuring strongly. In an invited paper, MediaTek described the technological challenges of developing automotive surround-view radar systems for 360° proximity sensing for vehicles, concentrating on a 79GHz FMCW (frequency-modulated continuous-wave) ...

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RGB UV IR light sensor is under 1x2mm

STMicroelectronics has introduced a multi-spectral ambient light (plus UVA and near-IR) sensor, with flicker detection, in a package smaller than 1mm x 2mm. Applications are foreseen with phone cameras for white-balance, artificial/natural/outdoor light discrimination and flicker frequency measurement – the latter to avoid banding and set exposure time. Called VD6281, it is claimd to be ...

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GloFo and Dolphin combine on ABB IP

GLOBALFOUNDRIES  and Dolphin Integration are to develop a series of adaptive body bias (ABB) IPs to improve the energy efficiency and reliability of  SoCs made on GloFo’s 22nm FD-SOI (22FDX) process. Dolphin and GLoFo are working together to develop a series of off-the-shelf ABB solutions for accelerating and easing body bias implementation on SoC designs. ...

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Hi-rel 40W dc-dc has 1in footprint and 10 year warranty

Cosel has announced a high reliability 40W dc-dc converter,with a 10 year warranty. Called MGF40, it comes in an industry standard 1 x 1inch (~25 x 25mm) six-sided-shielded metallic case and is said to have a failure rate of below 30ppm. “To guarantee lifetime quality, the MGF40 does not include aluminium or tantalum capacitors,” said ...

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Dual 100V mosfet is AEC-Q101 qualified

Toshiba has released a dual n-channel mosfet with high ESD protection, intended for automotive applications including driving headlight LEDs. Made on the firm’s U-MOSⅧ-H process and AEC-Q101 qualified, it is called SSM6N813R. Each transistor in the package has a maximum current of 3.5A (subject to junction temperature) and maximum drain-source voltage of 100V – a ...

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Passive-active antenna to optimise tower space

CommScope is collaborating with Nokia to develop passive-active antenna solutions which enable operators to optimise tower space usage, increase cell site capacity and prepare for 5G. As 5G roll-out starts, 5G MIMO antennas capable of 3.5 GHz frequency bands may need to be deployed,  CommScope and Nokia are developing new passive-active antenna solutions to boost ...

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Imec develops 3.2GSps RF-sampling ADC

Imec has developed a compact, highly linear 3.2 giga-sample-per-second (GSps) RF-sampling ADC that uses ring amplification (ringamp). The ADC has a record low power consumption of 61.3mW and supports multiband operation and massive MIMO implementation – two key features of future 5G base stations. A second power-efficient ringamp-based ADC – reconfigurable between 6 and 600Msps ...

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Adding alkali metal to perovskite solar cells changes the solar game

Researchers from  Georgia Tech, UC San Diego and MIT havr discovered that adding alkali metal to perovskite solar cells could enable energy devices to last longer and maintain better performance. “Perovskites could really change the game in solar,” says David Fenning  of UC San Diego, “they have the potential to reduce costs without giving up ...

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LoraWAN access module

dRenesas and Miromico have come up with module which enables connections to LoRaWAN-based networks. The module, FMLR-61-x-RSS3, uses Renesas’ Synergy Platform, giving access to MCUs and software.  Customers can use the S3A6 MCU on the LoRa-based module to handle various tasks, while streaming data across a LoRaWAN-based network to the cloud.  The LoRaWAN protocol is being used ...

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18V process for LCD/OLED drivers

MagnaChip Semiconductor, the Korean mixed-signal vendor, is offering foundry customers its second generation 0.13 micron 18V high voltage process technology. The technology, which is dedicated for designing source drivers for LCD and OLED televisions, offers fewer steps, allows suitable high voltage device design rules to shrink chip size and adds a new device for DAC ...

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Smart connector integrates EEPROM

Bulgin has launched a smart connector which claims to allow easy pairing of devices and connectors, real-time connection status sensing and electronic device serialisation. Its rugged, miniature design is claimed to be impervious to the harshest possible environmental conditions such as temperature extremes, exposure to dirt, water immersion and chemical spray. The intelligent connector enables ...

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Meta surfaces steer RF, light or sound arbitrarily

 Meta-surfaces can be designed to steer sound or electromagnetic waves is arbitrary directions, or act as beam splitters, according a team from Aalto University in Finland and Duke University North Carolina. “Existing solutions for controlling reflection of waves have low efficiency or difficult implementation,” said Aalto researcher Dr Ana Díaz-Rubio. “We solved both of those problems. ...

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TSMC takes $550m hit on defective photoresist material.

TSMC has completed of an assessment of all wafers recently affected by a batch of problematic photoresist material, and has concluded that the incident will reduce TSMC’s Q1 revenues by about US$550 million. The incident will reduce gross margin by 2.6pp, operating margin by 3.2pp, and EPS by NT$0.42, said TSMC. TSMC said it discovered ...

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UK can cope with any risks in Huawei switchgear, says NCSC

The National Cyber Security Centre (NCSC) has concluded that it can cope with any risks associated with using Huawei switchgear in UK 5G networks, reports the FT. The decision could have an effect on other countries which are considering whether to ban Huawei from bidding for 5G contracts. The FT quotes a source as saying: ...

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Uber heavily subsidising its rides

Uber made a loss of $1.8 billion on revenues of $11.3 billion in 2018 with half of the loss incurred in Q4. The $1.8 billion full-year loss was an improvement on 2017’s full-year loss of $2.2 billion. Uber’s 2018 revenues were 43% up on 2017’s revenues. Q4 bookings of $14.2 billion were up 11% on ...

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ST and Sequans develop LTE for MCUs

Sequans and ST are co-developing LTE for MCUs used in IoT applicarions. From this collaboration, the companies have developed a dedicated cellular extension board for STM32 Discovery kits based on Sequans’ Monarch LTE-M/NB-IoT technology. ST has also enlarged its STM32CUBE cellular software library to support Sequans’ existing Monarch-based module, GM01Q. A more integrated solution, enriching ...

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Data mining for new organic compounds

Researchers at the Technical University of Munich (TUM) are using data mining to identify promising organic compounds for the electronics of the future. Producing traditional solar cells made of silicon is very energy intensive. On top of that, they are rigid and brittle. Organic semiconductor materials, on the other hand, are flexible and lightweight. They ...

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UltraSoc adds features to on-chip analytics

UltraSoC, the Cambridge on-chip analytics IP company, has extended its embedded analytics architecture. The new features allow SoC designers to build on-chip monitoring and analytics systems with up to 65,000 elements, allowing seamless support for systems with many thousands of processors. Future iterations will allow even higher numbers of processors for Exascale systems. In addition ...

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10% distie growth for Germany’s Q4

Unusually high sales growth of almost 10% in the last quarter of 2018 brought a happy ending of the year for the German electronic component distribution market, reports the  Fachverband Bauelemente-Distribution (FBDi). Sales by FBDI members collectively grew 9.8% to 928 million euros. Conversely, orders fell 4.2% to 933 million euros, equating to a balanced ...

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Pico-ITX board has DSP for voice processing

Estone Technology has announced pico-ITX embedded processing board which includes DSP for voice control applications. Called EMB-2238, it is based around quad Arm Cortex-A53 cores in an NXP i.MX8M, plus a single Cortex-M4. “This board takes the advantage of NXP’s latest i.MX8M application processor with up to 15 year longevity, advance audio and 4k video ...

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Sponsored Content: Electrolube – Conformal Coatings versus Potting Compounds

Conformal Coatings Vs Potting Compounds – Which is better to protect my PCB, a coating or a resin, asks Phil Kinner and Alistair Little of Electrolube? This is a question that is often asked throughout the electronics industry and like any good engineering answer, it depends… on the degree of environmental protection required. The first ...

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Guerrilla adds to auto amp line

Guerrilla RF, the Greensboro, North Carolina MMIC specialist, has added to its AEC-Q100 automotive-qualified amplifiers. The GRF2073-W ultra-low noise amplifier is targeted at high-volume applications, with first-stage satellite radio LNAs and GPS modules being prime examples. It cones in an industry-standard, ultra-small 2.0 x 2.0 mm DFN-8 package thus sharing a common pin out with ...

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J P Morgan to issue crypto-currency

J P Morgan is to issue a prototype crypto-currency operated over its in-house blockchain network known as Quorum. Unlike Bitcoin and most other crypto-currencies the value of JP Morgans crypto-currency will be pegged to the US $ which stops it becoming a vehicle for highly volatile speculation. As a means of exchange, the J P ...

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JPR Electronics upgrades portal

JPR Electronics, the Dunstable distributor which celebrates its 40th anniversary this year, has launched a new website. Many key component and enclosure manufacturers are among the 70 plus brands stocked by JPR Electronics, and available on http://bit.ly/2TOGZ4o. All are supported by their experienced Sales Team and securely shipped from their EN ISO 9001:2008 approved warehouse. Product ...

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Pi-Casso Design Challenge for digital artists

Farnell element14 has launched the Pi-Casso Design Challenge to encourage the creation of  digital artwork showcasing the Raspberry Pi 3 Model B+ which surpasses conventional thinking of what electronics projects can be. “The world’s most famous artists from Van Gogh to Picasso broke barriers and created artwork that made a profound impact on the world, and ...

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ST launches MCU development tool for motor-control applications

ST has launched a single entry point  for access to all resources for motor-control application development  with STM32 and STM8 MCUs called ST-MC-SUITE. The tool lets users gather tutorials and documentation, store project setups (HW and SW), get links to download software solutions including the newly updated X-CUBE-MCSDK package, and buy evaluation hardware online. Intuitive ...

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Arm adds neural networking instructions to Cortex-M

Arm has added neural network processing instructions to its Cortex-M architecture, aiming at products at the outside edge of IoT networks, such as devices that can recognise a few spoken words without connecting to the cloud – vocal wake commands for example. The ‘M-Profile Vector Extensions’ (MVEs) have been announced under the brand ‘Helium’, and ...

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Smart buildings can be a leading light in the IoT

Lights are the most prevalent electrical components in any commercial building, and that makes them the most logical devices for smart building sensors, according to Russ Sharer, vice president of global marketing and business development at Fulham. “In new construction you can plan to use standalone smart building control sensors, but only 8% of commercial ...

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UK manufacturer doubles work space

Yorkshire-based Contract Production Ltd (CPL) has acquired its current head office and production facilities in Pickering North Yorkshire, and expanded into a third adjoining unit almost doubling its work space. The firm produces a range of sub-contract electronic products and PCB assemblies. Its shareholders purchased 9,600 sq ft, spread across the three units on the ...

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Telonic Instruments ships Kikusui’s compact SMPS

Compact switching power supplies designed to reduce power consumption and cost for a range of markets, the PCR-WE/WE2 series by Kikusui are now available from its authorised UK and Southern Ireland distributor, Telonic Instruments. The multi-functional switching AC power supplies range from 1kVA to 36kVA AC/DC output with frequency conversion from Hz to 5kHz. They ...

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Dc-dc converters handle 12:1 inputs for railway equipment

From Polytron Devices or New Jersey, OFQC40 and OFQC60 are 40 and 60Watt series of quarter-brick dc-dc converters with a 12:1 input range for railway equipment. Input options are 9-75Vdc or 14-160Vdc, according to EN50155, the the supplies meet that standard for railway applications, as well as being compliant to EN55032. Output options are: 5, ...

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Sensor measures wireless IR tyre temperature

Believed to be the only sensor available that can perform wireless infrared (IR) tyre temperature measurements, the IRN8WS4 transmits data to a generic master receiver in 868, 902 or 920-MHz frequencies. This, says the Texense Renvale Group, gives users the option to pick the best one frequency, depending on the location.  It uses a reliable, ...

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Takwan leads in wafer capacity

Taiwan has more installed wafer capacity than any other country, reports IC Insights. IC Insights has taken the actual geographic location of the fabs irrespective of the nationality of their owner, so a Samsung fab in the US is counted as part of US capacity. ROW  consists primarily of Singapore, Israel, and Malaysia, but also ...

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CML’s 50th

CML, the Essex fabless chip company, is celebrating 50 years in the semiconductor industry. The company was founded in December 1968 by George Gurry who was succeeded by his son, Mike who, with his brother Chris (pictured), remains part of today’s management team. CML was founded to pursue systems, or sub-systems, on-chip, rather than single ...

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InnoPhase integrates wireless IoT-on-a-chip

InnoPhase, the six tear-old San Diego low a new fabless power wireless start-up, has brought out Talaria TWO –  a complete wireless IoT solution on a single chip. It contains a full functionality multiprotocol transceiver, MAC/PHY, digital power amplifier and an embedded ARM processor for lightweight applications. The Talaria TWO chip is designed for battery-based IoT ...

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ON launches sensor dev kit

ON Semiconductor has introduced its RSL10 Sensor Development Kit, designed to provide engineering teams with a  platform for developing IoT applications with  smart sensor technology, and enabled by BLE. The RSL10 Sensor Development Kit brings together the RSL10 System-in-Package (RSL10 SIP) with a range of advanced low power sensors from Bosch Sensortec. The development platform provides ...

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Intel’s USB stick for developing deep neural networks

RS Components is stocking Intel’s Neural Compute Stick 2, for fast deep-learning IoT development. “As well as for use by data scientists and academics, the device is ideal for developers and engineers looking at integrating computer-vision and artificial intelligence capabilities into their IoT,” according to RS. Like the earlier Movidius Neural Compute Stick, NCS 2 ...

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Protected load switch handles 4A for USB

AP22815 is a single channel 3A-limited high-side power switch from Diodes, with output over-voltage protection, optimised for USB and other hot-swap applications which need to have over-voltage protection. AP22615 is similar, but with output current adjustable over 400mA to 4A – Internal Rds(on) is 40mΩ. Input range is 3V to 5.5V. USB PD3.0 fast role swap is supported, ...

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40V 3x3mm mosfets handles 300W for car powertrains

Nexperia is aiming at automotive powertrain applications with a 40V 3 x 3mm mosfet Called BUK7M3R3-40H (or BUK9M3R3-40H for logic level), the AEC-Q101 devices feature an Rds(on) of 3.3mΩ and are intended to switch 30W to 300W – allowing them to replace larger DPAKs in some applications. The firm has used its Trench 9 super-junction technology inside ...

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AI predicts material properties after straining

Scientists from Nanyang Technological University, Singapore (NTU Singapore),  MIT and the Skolkovo Institute of Science and Technology in Russia, have developed a machine learning approach that can predict changes to the properties of materials from straining the material. This work could lead to the possibility of engineering new materials with tailored properties for potential use in ...

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Ethical AI must resolve tensions

An ethical approach to the development and deployment of algorithms, data and AI (ADA) requires clarity and consensus on ethical concepts and resolution of tensions between values, says a report from the Nuffield Foundation and the Leverhulme Centre for the Future of Intelligence at the University of Cambridge. This report sets out a broad roadmap ...

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650V SiC Schottky diodes

Littelfuse has introduced two 650V, AEC-Q101-qualified SiC Schottky Diodes. The LSIC2SD065CxxA and LSIC2SD065AxxA Series SiC Schottky Diodes are available with a choice of current ratings (6A, 8A, 10A, 16A or 20A). They offer power electronics system designers a variety of performance advantages, including negligible reverse recovery current, high surge capability, and a maximum operating junction ...

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ST integrates machine learning into inertial sensors

ST has integrated machine-learning technology into its advanced inertial sensors to improve activity-tracking performance and battery life in mobiles and wearables. The LSM6DSOX iNEMO sensor contains a machine-learning core to classify motion data based on known patterns. Relieving this first stage of activity tracking from the main processor saves energy and accelerates motion-based apps such as ...

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EEVblog #1180 – Component Parametric Search Tutorial

EEVblog #1179 – Mailbag

EEVblog #1178 – Build a $10 DIY EMC Probe

eevBLAB #59 – Patreon Is An Unsustainable Business!

EEVblog #1177 – Ericsson PABX Teardown

EEVblog #1176 – 2 Layer vs 4 Layer PCB EMC TESTED!

Richard Wilson, our friend and former editor, has died

This is a sad day at Electronics Weekly, as we just learned that our former editor Richard Wilson died over the weekend, with his family alongside, after a long illness. I can’t say enough nice things about Richard. At work, he was incredibly hard-working, wise, effortlessly intelligent and dedicated to keeping Electronics Weekly on an ...

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3W and 5W ac-dc PSUs mount in many ways, including DIN rail

CUI has announced a couple of encapsulated ac-dc PSUs with multiple mounting options – 3W and 5W models. The single output PSK‑S3 types are housed in packges down to 37 x 24.5 x 18mm, and PSK‑S5B is the other type. PSK‑S3‑L and PSK‑S5B‑L have wire leads PSK‑S3‑T and PSK‑S5B‑T chassis mount PSK‑S3‑DIN and PSK‑S5B‑DIN mount ...

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20 – 40A DIN rail redundancy module shares load between two PSUs

TDK has introduced the DRM40 series of DIN rail mount redundancy modules. Two 10V to 30Vdc inputs are rated at 20A each and the output at 40A. 150% peak load is available for four seconds for capacitive and inductive loading, and the internal (reverse current protection) mosfets have a 200mV drop, reducing power losses in ...

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UK scope maker opens software development site in Manchester

In the hunt for programmers, Pico Technology has opened a software office in Manchester. “Pico is growing faster than we can recruit software engineers at our head office in St Neots, so today sees the opening of an additional software development office in Manchester,” said MD Alan Tong. The firm makes its scopes, which use ...

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Imec simulation tool calculates energy yield of bifacial PV systems

Imec and EnergyVille have  a new simulation framework that can accurately calculate the energy yield of bifacial PV systems (also capturing reflected light from the ground). The high precision of the new simulation framework compared to existing approaches comes from the fact that the framework not only computes the energy yield of the individual cells ...

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TSMC to start 7nm on EUV next month

 18 out of the 30 EUV machines which ASML will ship this year will go to TSMC, reports Digitimes. At the end of March, TSMC is expected to begin volume production of a version of its 7nm process which uses EUV. It first started volume production  on 7nm using immersion lithography in April 2018. This ...

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Jedec wide bandgap committee issues first standard

Jedec’s new wide bandgap committee has issued its first standards paper – JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices. JEP173 covers GaN power FETs, providing a method for the consistent measurement of drain-to-source resistance in the ON-state (RDS(ON)) encompassing dynamic effects. These dynamic effects are characteristic of GaN power FETs, ...

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Autonomous delivery vehicle start-up raises $940m

Three year-old autonomous delivery van start-up Nuro of New Jersey has received a $940 million investment from The Vision Fund. Nero, which was founded by two Waymo engineers, has now raised $1 billion. SoftBank’s investment was made at a company valuation of $2.7 billion. Nuro began running a delivery service in San Francisco last year ...

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Intel and Ericsson combine on cloud infrastructure development

Ericsson and Intel are aligning their development work on Ericsson SDI Manager software and Intel Rack Scale Design (RSD) for Network Functions Virtualization (NFV), distributed cloud, and 5G. ‘This new collaboration will focus on software in addition to hardware and we see it to be truly transformative for service providers’ ability to successfully deploy open ...

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AIStorm raises $13.2m

AIStorm of San Jose, which uses analogue processing instead of GPUs for machine learning at the edge, has closed a $13.2 million in Series A financing from Egis Technology, TowerJazz, Meyer Corporation and Linear Dimensions Semiconductor. “This investment will help us accelerate our engineering & go-to-market efforts to bring a new type of machine learning to the ...

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Apple pricing itself out of China market

Apple’s 20% drop in iPhone unit sales and 27.7% y-o-y drop in iPhone revenues in China in Q4 were due to the high unit price, says IDC. The cheapest of last year’s iPhones was $749 and the most expensive was $1,449. “In addition to the regular performance upgrades in 2018, there is no major innovation ...

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EPSRC puts cash into electrical machines for UK plc

The Engineering and Physical Sciences Research Council (EPSRC) is putting £10m into the ‘Future Electrical Machines Manufacturing Hub’, to be led by Professor Geraint Jewell at the University of Sheffield, with connections to Newcastle University and the University of Strathclyde. Industrial partners include Rolls-Royce, Siemens, GKN, Dyson, Protean Electric and Hoganas. “The Hub will address ...

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Autonomous driving start-up raises $530m

Aurora, the two year-old San Francisco autonomous driving start-up, has raised more than $530 million in a second funding round led by Sequoia. The investment was made at a compsny valuation of $2.5 billion, Last year the company raised $90 million. Aurora is focussed on Level 4 autonomous driving which means driverless in metropolitan areas. ...

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