Novati Technologies Inc. (a wholly owned subsidiary of Tezzaron Semiconductor) already gone beyond Micron's 3D Hybrid Memory Cube (HMC) by doubling the number of memory die to eight, but now its adding analog, mixed signal, microelectromechanical system (MEMS) and the sensors to the mix--enabling systems-on-chip to pack at lease 18 layers into the same footprint of its Integrated Sensor Platform.
from EETimes: http://ift.tt/1N0dN4o
via Yuichun
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